Metal spraying material of tin, zinc, cupper, and chrome without lead
A technology of spraying gold material and copper-chromium, which is applied in metal material coating process, metal processing equipment, welding/cutting medium/material, etc. Creep performance, effect of good electrical contact performance
Inactive Publication Date: 2007-10-10
戴国水
View PDF0 Cites 4 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
The existing lead-free gold spray materials are typically tin-zinc series alloys, which have the lowest melting temperature of 198°C, but tin is expensive. In order to reduce its cost, the zinc content is added, but its performance is limited to a certain extent.
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreExamples
Experimental program
Comparison scheme
Effect test
Embodiment 1
[0018] Embodiment 1: 10% of zinc (Zn), 1% of copper (Cu), 0.01% of chromium (Cr), and the rest are tin (Sn) and impurities whose total amount is not more than 0.1%.
Embodiment 2
[0019] Embodiment 2: Zinc (Zn) 2%, copper (Cu) 3%, chromium (Cr) 0.05%, the rest is tin (Sn) and the impurity that total amount is not more than 0.1%.
Embodiment 3
[0020] Embodiment 3: Zinc (Zn) 20%, copper (Cu) 1.5%, chromium (Cr) 0.1%, and the rest is tin (Sn) and impurities whose total amount is not more than 0.1%.
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
This invention discloses a leadless Sn / Zn / Cu alloy sputtering material for end sputtering of metalized thin film capacitor. The leadless Sn / Zn / Cu alloy sputtering material comprises: Zn 2-50 wt.%, Cu 0.55-3.5 wt.% (preferential 0.6-2.5 wt.%), Cr 0.01-0.5 wt.% (preferential 0.05-0.3 wt.%), impurities less than or equal to 0.1 wt.%, and Sn as balance. The addition of trace Cr can improve the mechanical properties, end adhesiveness, weldability, antioxidative performance, and electrical contact performance of the Sn / Zn / Cu alloy sputtering material, reduce the loss angle of the capacitor, and increase the qualification rate of the metalized thin film capacitor in 100 kHz high-frequency test.
Description
technical field [0001] The invention relates to a tin-zinc-copper-chromium lead-free gold-spraying material, which belongs to the technical field of preparation of gold-spraying materials on the end faces of metallized film capacitors. Background technique [0002] The existing gold-sprayed materials on the end face of metallized film capacitors are typically lead-based five-component gold-sprayed materials and tin-zinc-based gold-sprayed materials. However, due to the great toxicity of lead to humans, it has attracted great attention from the world and the rise of lead-free trend. Many alternative lead-free gold-spraying materials have come out, and lead-free materials with better performance are still being developed to replace lead-containing gold-spraying materials. At present, the general requirements for lead-free gold-spraying materials are: 1. Lead The content is less than 0.1%; 2. The gold-sprayed layer and the lead wire have good weldability;...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): C23C24/00C22C13/00C22C18/00C22C30/00B23K35/22
Inventor 戴国水
Owner 戴国水
PatSnap Eureka turns technology decisions into work you can execute. Powered by our Innovation Knowledge Graph, it runs expert workflows across engineering, life sciences, materials and intellectual property. Get your review-ready output in minutes.
