Optical display packaging structure and its method

Abstract

The invention discloses a kind of optics indicator structure and method, it includes several projections which is covered with wafer and set on the base board and several projection cushions which are set on chip of integrated circuit on corresponding base board, the projection cushions contacts with the projections which is covered with wafer, and they are under hot-press function of joint press and a joint temperature, the projection cushions and the projections are fused to conduct the base board and the integrated chip.

Description

technical field [0001] The present invention relates to the construction structure of electronic components, more specifically, it refers to a construction structure of an optical display. Background technique [0002] Fig. 1 is a common optical display structure 1, which includes a glass substrate 2, a driver IC 3 and an anisotropic conductive film (Anisotropic Conductive Film, ACF) 4, wherein the surface of the glass substrate 2 is provided with a plurality of ITO conductive Film 2a, a plurality of bumps 3a are provided on one surface of the driver IC 3, the anisotropic conductive adhesive 4 bonds the glass substrate 2 and the driver IC 3, and contains a plurality of conductive particles 4a; when bonding the glass substrate 2 and the drive IC 3, each ITO conductive film 2a is relatively close to the corresponding bump 3a, and is electrically connected by clamping the conductive particles 4a between them. Functional characteristics, the distance between adjacent bumps 3a m...

AI Technical Summary

Problems solved by technology

[0002] Fig. 1 is a common optical display structure 1, which includes a glass substrate 2, a driver IC 3 and an anisotropic conductive film (Anisotropic Conductive Film, ACF) 4, wherein the surface of the glass substrate 2 is provided with a plurality of ITO conductive Film 2a, a plurality of bumps 3a are provided on one surface of the driver IC 3, the anisotropic conductive adhesive 4 bonds the glass substrate 2 and the driver IC 3, and contains a plurality of conductive particles 4a; when bonding the glass substrate 2 and the drive IC 3, each ITO conductive film 2a is relatively close to the corresponding bump 3a, and is electrically connected by clamping the conductive particles 4a between them. Functional characteristics, the distance between adjacent bumps 3a must be reduced to increase the number of bumps 3a per unit area of ​​the driver IC 3, but when the distance between two adjacent bumps 3a is narrow, it is easy to Cause a plurality of conductive particles 4a located between adjacent bumps 3a to push and contact each other, and then form a bridging effect on two adjacent bumps 3a to cause a short circuit. Secondly, the conductive particles between the ITO conductive film 2a and the bumps 3a Particles 4a may also be crushed and damaged due to excessive pressing force, resulting in poor electrical contact

[0003] Please refer to FIG. 2 again, which is another potential poor conductive contact in the above structure, that is, after the driver IC 3 and the glass substrate 2 complete the lamination process, some conductive particles 4a' may be broken due to poor material ratio. The lack of elasticity makes it unable to return to its original shape after being deformed by pressing, so it cannot contact the bump 3a and the ITO conductive film 2a at the same time, resulting in an open circuit

[0004] In order to improve the above deficiencies, some people in the industry have developed an optical display assembly structure 1' as shown in Figure 3. The structure 1' is bonded with a non-conductive film (Non-conductive Film, NCF) 5 without conductive particles. The glass substrate 6 and the driver IC 8, and the structure 1' is further provided with a corresponding composite bump 7 on the surface of the ITO conductive film 6a of the glass substrate 6. The composite bump 7 is composed of an elastic body 7a and a The metal film 7b of the elastic body 7a is composed of the metal film 7b. During the pressing process of the glass substrate 6 and the driver IC 8, the composite bump 7 is in contact with the bump 9 provided on the driver IC 8. As the glass substrate 6 and the driver IC 8, the elastic body 7a of the composite bump 7 will be properly deformed, so that the metal film 7b can contact the bump 9 with a larger area, so as to obtain the purpose of electrical connection, but, when pressing, often A larger pressing force is applied to ensure that the bump 9 can be in contact with the composite bump 7. However, an excessive pressing force may easily cause the original extremely thin metal film 7b to be damaged due to extrusion, resulting in poor electrical connection.

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