Heat radiating device
A technology of a heat sink and a heat sink, which is used in cooling/ventilation/heating transformation, instruments, electrical digital data processing, etc., can solve the problem of small contact area, affecting the heat dissipation efficiency of the heat sink 30a problems such as low thermal conductivity, to achieve the effect of improving thermal conductivity
Inactive Publication Date: 2010-12-22
FU ZHUN PRECISION IND SHENZHEN +1
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Problems solved by technology
[0004] However, since the heat pipe 20a and the heat dissipation fins 30a only pass through the holes of the heat dissipation fins 30a, the contact area between the heat pipe 20a and the heat dissipation fins 30a is small, and the thermal conductivity from the heat absorbing plate 10a to the heat dissipation fins 30a is relatively low. , affecting the heat dissipation efficiency and high heat dissipation performance of the entire heat dissipation device
Method used
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Embodiment Construction
[0018] see figure 1 , is an assembly diagram of the first embodiment of the heat sink of the present invention. The heat dissipation device shown is used for dissipating heat from a heat-generating electronic component (not shown in the figure), and the heat dissipation device includes a base 10, a heat sink 20 placed on the base 10, a heat sink connected to the heat-generating electronic component and the heat sink 20 The plate heat pipe 30 and a fan 40 installed on one side of the cooling body 20 .
[0019] see figure 2 The cooling body 20 is composed of a plurality of cooling fins, each cooling fin is spaced apart from each other to form a plurality of channels, and the airflow generated by the fan 40 flows through the channels to dissipate heat from the cooling body 20 . The bottom surface 22 of the heat sink 20 is provided with a protruding portion (not shown), and the protruding portion passes through the through hole 160 of the base 10 and contacts the upper surface...
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A kind of radiating device is used to be contacted with a heating electronic component; it includes a base which possesses a through hole; a radiating body which is set on the base and possesses several channels; a board heat pipe which is connected with said heating electronic component and radiating body and possesses a decalescence section, a thermopositive section and a connection section, thereinto the decalescence section covers upper surface of said heating electronic component and is placed on the base and contacted with bottom of the radiating body via through hole, said thermopositive section is parallel with the decalescence section and contacted with the top of the radiating body, said connection section connects the same side end of the decalescence section and the thermopositive section. Comparing with current technique, the radiating device possesses board heat pipe with bigger contacting surface, the board heat pipe is connected with the heating electronic component and the radiating body, heat generated by heating electronic component can be transferred to the radiating body quickly and evenly, the heat conductivity can be increased.
Description
technical field [0001] The invention relates to a heat dissipation device, in particular to a heat pipe heat dissipation device. Background technique [0002] Heat-generating electronic components (such as central processing units) generate a lot of heat during operation, which increases the temperature of itself and the system, which in turn leads to a decrease in its operating performance. In order to ensure the normal operation of the heating electronic components, a cooling device is usually installed on the heating electronic components to discharge the heat generated by them. [0003] Figure 9 Shown is a traditional heat dissipation device, including a heat absorbing plate 10a, a plurality of cooling fins 30a arranged on the heat absorbing plate 10a, and a heat pipe 20a connecting the heat absorbing plate 10a and the cooling fins 30a. The cross section of the heat pipe 20a is circular, and includes a heat absorbing section contacting the heat absorbing plate 10a, and...
Claims
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IPC IPC(8): H05K7/20H01L23/427G06F1/20
Inventor 彭学文陈兵李君海
Owner FU ZHUN PRECISION IND SHENZHEN