Method for forming electromagetic interference shielding film on non-conducting material and structure thereof

Abstract

The present invention relates to a method of forming a kind of electromagnetic disturbance masking film onto non-conductive materials and the structure of this film. The method includes: offering a kind of non-conductive material, forming a medium layer on the upper-surface of this material, and sputtering one ore more layers of metal conductive film on the medium layer. The medium layer close contacts to the non-conductive material, and the metal conductive film close contacts to the medium layer, therefore the surface adhesion between the non-conductive material and the electromagnetic disturbance masking film is increased by the medium layer. The structure of this masking film is set on a surface of a non-conductive material, and includes a medium layer set on and close contacting the surface of the non-conductive material, a metal conductive layer set on and close contacting the surface of the medium layer. The surface adhesion of the electromagnetic disturbance masking film adhering to the non-conductive material is increased by the medium layer.

Description

technical field [0001] The invention relates to a method for forming an electromagnetic wave interference shielding film on a non-conductive material and its structure, in particular to a method for forming an electromagnetic wave interference shielding film with an intermediary layer on a non-conductive material and its structure. Background technique [0002] The existing known method of eliminating electromagnetic interference (electromagnetic interference, hereinafter referred to as EMI) is to form a shielding layer with low impedance on the plastic casing (non-conductive material) of various electronic components or equipment to shield EMI Generally, a metal coating is directly formed on a non-conductive material as an electromagnetic wave interference shielding film, and the metal coating is mostly formed by spraying paint, printing, chemical metallization, vacuum metallization or directly covering a metal foil, etc. However, due to the difference in material propertie...

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Problems solved by technology

[0002] The existing known method of eliminating electromagnetic interference (electromagnetic interference, hereinafter referred to as EMI) is to form a shielding layer with low impedance on the plastic casing (non-conductive material) of various electronic components or equipment to shield EMI Generally, a metal coating is directly formed on a non-conductive material as an electromagnetic wave interference shielding film, and the metal coating is mostly formed by spraying paint, printing, chemical metallization, vacuum metallization or directly covering a metal foil, etc. However, due to the difference in material properties, it is not easy to form a tight surface adhesion between the non-conductive material and the EMI shielding film. However, poor surface adhesion will not only affect the shielding power of the EMI shielding film, but also reduce the electronic Long-term reliability of the product

[0003] It can be seen that the above-mentioned existing method for forming an electromagnetic wave interference shielding film on a non-conductive material and its structure obviously still have inconvenience and defects in terms of method, product structure and use, and need to be further improved urgently.

In order to solve the above-mentioned existing problems, relevant manufacturers have tried their best to find a solution, but no suitable design has been developed for a long time. This is obviously a problem that relevant manufacturers are eager to solve.

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