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Lead-free solder for micro alloyed eutectic alloy of stannum and zinc

A technology of micro-alloying and eutectic alloy, which is applied in the direction of welding/cutting medium/material, welding medium, welding equipment, etc., can solve the problems of easy oxidation of liquid alloy surface, difficult removal of oxide film, poor wettability, etc., to achieve convenient Large-scale production organization and production process control, production organization and recycling are convenient and easy to stabilize the effect

Inactive Publication Date: 2007-12-26
有研科技集团有限公司
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  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the problems such as poor wettability caused by the easy oxidation of the surface of the liquid alloy and the difficult removal of the oxide film under non-vacuum conditions, the object of the present invention is to provide a Good spreadability; excellent mechanical and electrical properties), good process yield, using reliable micro-alloyed tin-zinc eutectic alloy lead-free solder, which retains the characteristics of Sn-Zn binary eutectic alloy to the greatest extent, At the same time, it overcomes the adverse effects of macroalloying on alloy performance, alloy cost and welding reliability, and is easy to promote to the solder manufacturing industry and electronic packaging fields.

Method used

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  • Lead-free solder for micro alloyed eutectic alloy of stannum and zinc
  • Lead-free solder for micro alloyed eutectic alloy of stannum and zinc
  • Lead-free solder for micro alloyed eutectic alloy of stannum and zinc

Examples

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Effect test

Embodiment 1

[0029] The prepared Sn, Zn, Sn-10Ge metal and alloy raw materials are prepared according to the composition formula of Sn-8.8Zn-0.08Ge to prepare 500g of alloy material, and the alloy is smelted under the protection of argon gas in a resistance furnace. The order of alloy addition is Sn, Zn , Sn-10Ge, after the alloy is completely melted, keep it at 400°C for 30 minutes to ensure the uniformity of the composition, reduce the heating power, and start pouring into the preheated stainless steel mold when the temperature of the solder melt drops to 250°C.

Embodiment 8

[0031] The prepared Sn, Zn, Ga, Sn-10Ge, Sn-10Al, Sn-5Ni and Sn-5P metal and alloy raw materials, according to Sn-8.7Zn-0.03Ga--0.015Ge-0.01Al-0.006P-0.04 Prepare 500g of alloy material with the Ni composition formula, and use the resistance furnace to melt the alloy under the protection of argon. Then keep it at 400°C for 30 minutes to ensure the uniformity of the ingredients, reduce the heating power, and start pouring the solder melt into the preheated stainless steel mold when the temperature of the solder melt drops to 250°C.

[0032] Other examples and comparative examples were prepared in the same manner as above-mentioned Examples 1 and 8, and their chemical compositions are shown in Table 1.

[0033] The alloy of the present invention can be prepared into master alloy blanks, welding rods, welding wires, welding balls and welding powders, and the specific preparation process is shown in Figure 4. It can be added in the way of pure metal, that is, adding pure metal ra...

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Abstract

The invention discloses a micro-alloying tin-zinc eutectic alloy tinless solder that the main constituent is Sn-Zn eutectic alloy, Zn is 8-10wt% and the rest is Sn, adding one or the complex from Ga, P, Al, Ge, and Mg, the content of single alloy element is below 0.1%. The invention extremely maintains the feature of Sn-Zn eutectic alloy, and has the advantages of strong oxidation resistance, simple constituents, easy to recycle, etc.

Description

technical field [0001] The invention belongs to the field of special functional materials, and relates to lead-free solder alloys in the field of soldering, in particular to a class of oxidation-resistant low-cost microalloyed Sn-Zn eutectics suitable for use in microelectronics manufacturing and integrated circuit packaging industries alloy lead-free solder. Background technique [0002] With the rise of the concept of "green soldering", the development of new lead-free solder has become a new topic faced by soldering workers all over the world. The reason why the traditional tin-lead solder has been widely used for thousands of years is inseparable from its excellent performance and low cost. However, the toxicity of lead and lead compounds has increasingly attracted people's attention. Lead in discarded electronic products dissolves in rainwater and seeps into the soil, directly affecting human health by polluting water sources. Therefore, in recent years, the call for ...

Claims

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Application Information

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IPC IPC(8): B23K35/26
Inventor 杨福宝郭宏徐骏石力开张品
Owner 有研科技集团有限公司
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