Copperplate surface printing ink and preparation method thereof
A technology of surface printing and copper plate, applied in the field of copper plate surface printing ink and its preparation, can solve the problems of poor toughness and adhesion of ink, high ink consumption, waste of environment, etc., and achieve enhanced freeze resistance and water resistance, and improved flexibility and adhesion, the effect of increasing hardness
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment Construction
[0033] Copperplate surface printing ink of the present invention comprises following substances according to mass fraction ratio composition:
[0034] Toluene 23~36.5
[0035] Mixed propanol 14~21
[0036] Ethyl ester 1~1.5
[0037] Butyl ester 1~3
[0038] Anti-white water 0~0.5
[0039] Benzene-soluble polyamide resin 20~24
[0040] Darmar Resin 2~4
[0041] Aldehyde and ketone resin (XK) 1~2.5
[0042] Aldehyde and ketone resin (CB) 0~3
[0044] Light powder 0~1.5
[0045] The preparation method of copperplate surface printing ink comprises the following steps:
[0046] a. Weigh an appropriate amount of solvent, add resin, disperse and stir at room temperature for about 2 hours to make a semi-finished product;
[0047] b. Weigh an appropriate amount of the semi-finished product obtained in step a and pour it into a ball mill, add pigment powder and additives and grind together at room temperature for 8-10 hours to obtain a copperplate surfa...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com