High efficiency LED heat radiating module

A technology of light-emitting diodes and heat dissipation modules, which is applied in the direction of electrical components, electric solid-state devices, circuits, etc. It can solve the problems of unimproved left and right heat dissipation functions of heat dissipation glue, inability to work stably with high-power light-emitting diodes, and reduced service life.

Inactive Publication Date: 2008-02-06
陈鸿文
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the patented technology still has the following problems. 1. The heat-conducting insulating layer is made on the substrate, and the substrate and the external heat sink use heat-dissipating glue as the heat-conducting medium, so that the heat can reach the external heat sink through the substrate, and then communicate with the outside air. The heat is exchanged and dissipated, so the problem of the left and right heat dissipation of the heat-dissipating glue has not been improved;

Method used

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  • High efficiency LED heat radiating module
  • High efficiency LED heat radiating module

Examples

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Embodiment 1

[0024] The method of LED heat dissipation module with high heat dissipation efficiency, as shown in Figure 1, 1. According to the heat dissipation requirements, the heat sink with the front heat dissipation fin 3 is made, and the structure of the heat sink is sunken in the middle; 2. The middle of the heat sink is sunken On the heat-absorbing end face 21, use reinforcing fibers, diamond fine particle powder, insulating inorganic materials and diamond composite materials of polymer binders to directly build up a convex curved surface electrically insulating and heat-conducting layer 8 containing diamond components; the third .The upper part of the electrical insulation and heat conduction layer is made of a metal circuit layer 4 by printing; fourth. There are two circuit channels 6 between the electrical insulation and heat conduction layer and the lower heat sink for the signal and power line 7 to pass through; fifth. A plurality of LED chips 5 are installed and packaged on the...

Embodiment 2

[0026] The method of LED heat dissipation module with high heat dissipation efficiency is shown in Figure 2. First, the heat sink is designed and manufactured according to heat dissipation requirements. Structure; second. on the end face 21 of the heat pipe that is flattened at the front end, use a diamond composite material to directly build up a concave curved surface electrical insulation and heat conduction layer 9 containing diamond components; third. the upper part of the electrical insulation and heat conduction layer, Fabricate the metal circuit layer 4 by etching; fourthly, install and package a plurality of LED chips 5 on the metal circuit layer 4 .

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Abstract

The present invention relates to a LED heat emission pattern assembly with high efficiency, and the heat emission pattern assembly directly makes an electric insulation heat conducting layer with diamond element on the heat absorbing end face of the radiator. The metal circuit layer can be provided with one or a plurality of LED components. The pattern assembly structure of the heat emission glue is not used, the present invention solves the problems of heat emission, blocking and piling to keep that the LED works in a normal temperature.

Description

technical field [0001] The invention relates to a light-emitting diode heat dissipation module, which belongs to the technical field of heat dissipation application. The structure of the heat dissipation module can be used in the assembly and use of light-emitting diode elements. Background technique [0002] With the continuous improvement of the power of the light-emitting diode element, the waste heat of work increases and the emission does not increase equally, resulting in the problem that the temperature of the element rises, the working efficiency decreases, and even the element is damaged. Review the commonly used heat dissipation methods, such as light-emitting diode components contacting the heat sink through the circuit board, heat dissipation glue, so that the heat of the electrical components is conducted to the heat sink to be discharged. However, the actual use shows that the current heat dissipation method still has the following three thermal resistance shor...

Claims

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Application Information

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IPC IPC(8): H01L23/36H01L33/00H01L33/64
Inventor 陈鸿文
Owner 陈鸿文
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