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Manufacturing method for terminal for connecting connector of wiring substrate

A wiring substrate and manufacturing method technology, applied in the direction of connection, printed circuit manufacturing, electrical connection printed components, etc., can solve the problems of expensive and complicated processing, and achieve the effects of preventing the generation of whiskers, preventing environmental pollution, and reducing costs

Inactive Publication Date: 2008-02-20
NIPPON MEKTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this requires two different coatings, and the processing becomes complicated. Although the cost is lower than that of a gold-plated single body, it is still relatively expensive.
The method of electroplating with pure tin or tin-based alloys (so-called lead-free solder) instead of gold plating is also carried out, but in this case, tin whiskers are likely to be generated, and there is a risk of leakage or short circuit.

Method used

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  • Manufacturing method for terminal for connecting connector of wiring substrate
  • Manufacturing method for terminal for connecting connector of wiring substrate
  • Manufacturing method for terminal for connecting connector of wiring substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] 1(a), 1(b) show a printed wiring board 10, in which a conductor such as copper foil is provided on the surface of an insulating base material 11, and unnecessary parts of the conductor are removed by etching to form a wiring pattern 12, and further, Cover with protective layer 13. A connector connection terminal 20 composed of a plurality of contact pieces 14 is exposed from one end of the opening 15 of the protective layer, and has a predetermined length L as indicated by a dashed-two dotted line. The connector connection terminal 20 is formed wider than the other wiring patterns 12 .

[0021] The terminal portion of the terminal 20 for connector connection is more extended than the above-mentioned predetermined length L, and the extension portion 21 can be accommodated in the opening portion 15 of the protective layer, but in the illustration, the extension portion 21 reaches the other end beyond the opening portion 15. The bottom surface of the protective layer 13 i...

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PUM

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Abstract

The invention provides a manufacturing method of connector connecting terminal of a wiring board. The connector connecting terminal consists of a plurality of contact pieces provided in the wiring board. The method comprises the following steps: arranging a protection layer covering a wiring pattern, the connector connecting terminal exposing an opening part of the protection layer, and the termination part of the connector connecting terminal extending longer than a predetermined length, arranging a connected area for connecting each other within an extension part, printing a soldering paste on the surface of the connector connecting terminal containing the connected area, when an area containing the extension part of the connected area is larger than that of contact pieces of the connector connecting terminal, fusing the printed soldering paste to form a soldering precoating layer, then cutting and removing the extension part with the connected area to form the predetermined length.

Description

technical field [0001] The present invention relates to a method of manufacturing a connector connection terminal formed on a side end of a wiring board, and particularly relates to a method of manufacturing a connector connection terminal to be fitted into a ZIF connector or a press-fit connector at a lower cost. method. Background technique [0002] In general, a conductive coating is often formed on the surface of a connector connection terminal in order to reduce contact resistance with the connector, prevent abrasion of the terminal itself, prevent oxidation of a metal material forming the terminal, and the like. The conductive coating is required to have characteristics such as not peeling off from the metal material, being uniform and thin, and not being oxidized and corroded. [0003] In the past, for the purpose of low cost, the method of electroplating lead-containing eutectic solder on the surface of copper was generally used. Due to environmental pollution probl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/40H01R43/00H05K1/11H01R12/04
Inventor 藤村隆士阿部洋一
Owner NIPPON MEKTRON LTD