Boro-silicate glass frits for hermetic sealing of light emitting device displays

A borosilicate glass and frit technology, which is used in electrical components, electrical solid devices, glass molding, etc.

Inactive Publication Date: 2008-03-12
CORNING INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Unfortunately, it has historically been difficult to develop a sealing process that hermetically seals emissive displays

Method used

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  • Boro-silicate glass frits for hermetic sealing of light emitting device displays
  • Boro-silicate glass frits for hermetic sealing of light emitting device displays
  • Boro-silicate glass frits for hermetic sealing of light emitting device displays

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0081] Preparation and application of glass frit

[0082] Glass frits are formed by combining the desired base and absorbing components, heating the mixture to a temperature sufficient to melt the components (e.g., about 1,550°C), mixing the materials, and subsequently cooling the resulting mixture glass part. The resulting composition can be fractured by subjecting it to thermal shock by pouring cold water or liquid nitrogen on it. If necessary, the broken pieces can be further crushed and ground to the desired particle size. In one aspect, the fractured fragments are crushed to a size of about 325 mesh, followed by wet milling to an average particle size of about 1.9 microns.

[0083] The frit paste is then formulated for dispensing onto the substrate by mixing the glass portion of the frit with other materials such as a paste binder and / or a paste filler for handling and dispensing the frit paste . The pasty binder and / or the pasty filler used to prepare the frit paste ...

Embodiment 1

[0100] Example 1: Glass frit composition of the present invention

[0101] In a first example, various frit compositions including oxide combinations were prepared. The specific composition of the glass portion of each sample of the present invention is listed in Table 2 below. All amounts detailed in Table 2 are expressed as mole %.

[0102] Table 2: Glass frit compositions of the present invention (glass fraction)

[0103] components

Embodiment 2

[0104] Embodiment 2: Preparation of glass frit powder of the present invention

[0105] In a second example, the components of Sample A of the present invention described in Table 2 above were combined. The resulting mixture was heated to about 1,550° C. for about 6 hours to melt the components.

[0106] This hot mixture is then broken up by pouring it into cold water. The broken pieces were then milled to 325 mesh and then wet milled to a particle size of approximately 1.9 microns.

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Abstract

A frit composition useful for sealing a light emitting device is disclosed. The frit composition comprises a glass portion comprising a base component and at least one absorbing component. The glass portion of the frit comprises silica, boron oxide, optionally alumina, and (a) cupric oxide and / or a (b) combination of ferric oxide, vanadium pentoxide, and optionally titanium dioxide. Also disclosed is an article comprising a substrate and a frit, and a glass package comprising two substrates and a frit positioned between the substrates. A method for manufacturing a hermetically sealed glass package comprising the deposition of a glass frit and heating of the glass frit to form a hermetic seal is also disclosed.

Description

technical field [0001] The present invention relates to a hermetically sealed glass package suitable for protecting thin film devices sensitive to the surrounding environment. Background technique [0002] Light emitting devices are the subject of considerable research in recent years. Organic light emitting devices (OLEDs) are of particular interest because of their use or potential use in many electroluminescent devices. A single OLED can be used, for example, in a discrete light emitting device, or an array of OLEDs can be used in lighting applications or flat panel display applications such as OLED displays. Conventional OLED displays are known to be very bright and have good color contrast and wide viewing angles. However, conventional OLED displays, especially the electrodes and organic layers within them, are prone to performance degradation due to the action of oxygen and moisture leaking into the OLED display from the surrounding environment. It is well known tha...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03C3/089C03C3/091C03C3/064C03C8/24C03B23/203
CPCC03C27/06C03C3/066H01L51/5237C03C8/02C03C3/093C03C8/04C03C8/24C03C3/091H10K50/8426C03C3/076C03C3/083C03C3/089
Inventor H·D·布克P·S·丹尼尔森R·M·莫伦纳K·P·雷迪
Owner CORNING INC
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