Manufacturing method for semiconductor device and metal oxide semiconductor field effect transistor
A technology of field-effect transistors and oxide semiconductors, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as leakage and interference of parasitic transistors, passivation of sharp edges and corners, etc.
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[0039] The manner in which the various embodiments are made and used are described below. However, it should be noted that the various applicable inventive concepts provided by the present invention can be implemented according to various changes in the specific context, and the specific embodiments discussed here are only used to illustrate the specific use and manufacture of the present invention. method of invention, not intended to limit the scope of the invention.
[0040] The manufacturing process of the preferred embodiment of the present invention is described below through various drawings and examples. In addition, the same symbols represent the same or similar elements in various different embodiments and drawings of the present invention.
[0041] FIG. 4 shows a substrate 401 in which an isolation region 403 is formed. The substrate 401 may include doped or undoped silicon material, or an active layer of a silicon on insulator (SOI) substrate. A silicon-on-insul...
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