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Low-expansion high heat conductivity nonmagnetic ceramic seal alloy and preparation method thereof

A ceramic sealing alloy and high thermal conductivity technology, applied in the field of low expansion, high thermal conductivity, non-magnetic Mo-Cu-Ni ceramic sealing alloy and its preparation, can solve the problems of poor machining performance, complicated welding process, easy cracking, etc. The effect of good processing performance, simple welding process and not easy to crack

Active Publication Date: 2008-04-23
GRIMAT ENG INST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the above-mentioned materials have the following disadvantages, the coefficient of thermal expansion is the same as that of 95% Al 2 o 3 Porcelain has a certain gap, low thermal conductivity, more complicated welding process, poor machining performance, not resistant to severe cold and heat, easy to crack and other shortcomings

Method used

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  • Low-expansion high heat conductivity nonmagnetic ceramic seal alloy and preparation method thereof
  • Low-expansion high heat conductivity nonmagnetic ceramic seal alloy and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Preparation of Mo-Cu-Ni ceramic sealing alloy used as conductor structure material of wave tube in radar system. The process is as follows:

[0020] (1) Prepare materials according to the following alloy composition: Mo 77wt%, Cu 17wt%, Ni 6wt%.

[0021] (2) Mixing: Mix the prepared alloy materials uniformly in the mixer for 24 hours.

[0022] (3) compact, mixed alloy powder at 2T / cm 2 Cold isostatic internal pressing or alloy billets (pieces) of various specifications

[0023] (4) Pre-bonding: The alloy billet (piece) is pre-bonded within the temperature range of 850°C, and the time is set according to the charging amount.

[0024] (5) Sintering: The pre-sintered billets (pieces) are sintered at a temperature range of 1200°C, and the time is set according to the amount of charge. After sintering, it can be made into non-magnetic Mo-Cu-Ni ceramic sealing alloy.

[0025] Example 1 The non-magnetic Mo-Cu-Ni ceramic seal alloy is made to be used as the conductor struc...

Embodiment 2

[0027] Except that the alloy composition is different from Example 1, the others are the same as Example 1. The alloy composition of Example 2 is: Mo 80wt%, Cu 15wt%, Ni 5wt%.

Embodiment 3

[0029] Except that the alloy composition is different from Example 1, the others are the same as Example 1. The alloy composition of Example 3 is: Mo 70wt%, Cu 20wt%, Ni 10wt%.

[0030] The non-magnetic Mo-Cu-Ni ceramic sealing alloys produced in Example 2 and Example 3 are used as ceramic sealing materials and conductive heat dissipation elements on various electric vacuum tubes. Ceramic materials such as alloys and alumina can be directly sealed, and the weld seam is dense and reliable. up to 1×10 -10 Pa·m 3 / s high level.

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Abstract

The present invention discloses one kind of low expansion coefficient high heat conductivity non-magnetic sealing Mo-Cu-Ni ceramic alloy and its preparation process. The alloy has the recipe comprising Mo 70-80 wt%, Cu 15-20 wt% and Ni 5-10 wt%. It is prepared through a powder metallurgy process including the steps of compounding material, mixing, pressing blank, pre-sintering and sintering to form the alloy. It is applied as structural material for electronic industry, and Compared with kovar alloy and monel alloy, the alloy of the present invention has the advantages of heat expansion coefficient approaching that of 95 %Al2O3 ceramic, high heat conductivity, simple welding process, high machining performance, high heat shock resistance, etc.

Description

technical field [0001] The invention relates to a non-magnetic Mo-Cu-Ni ceramic sealing alloy with low expansion and high thermal conductivity and a preparation method thereof. Background technique [0002] At present, in the electronic industry, Kovar alloy and Monel alloy are mainly used as ceramic sealing materials as structural materials. However, the above-mentioned materials have the following disadvantages, the coefficient of thermal expansion is the same as that of 95% Al 2 o 3 Porcelain has a certain gap, low thermal conductivity, more complicated welding process, poor machining performance, not resistant to severe cold and heat, easy to crack and other shortcomings. Contents of the invention [0003] The purpose of the invention is to provide a non-magnetic Mo-Cu-Ni ceramic sealing alloy with low expansion and high thermal conductivity. [0004] Another object of the present invention is to provide a method for preparing a non-magnetic Mo-Cu-Ni ceramic sealing...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C27/04C22C1/04B22F3/16
Inventor 甘长炎郑杰夏志华
Owner GRIMAT ENG INST CO LTD
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