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Special-purpose material for automobile bumper and reclaiming utilizing method for waste printed circuit card
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A technology for automobile bumpers and printed circuit boards, which is applied in bumpers and other directions to achieve the effects of saving mineral resources, reducing material costs, and improving the degree of recycling
Active Publication Date: 2010-06-16
SICHUAN CHANGHONG ELECTRIC CO LTD
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[0006] At present, there is no relevant report on the use of non-metallic materials in waste printed circuit boards as raw materials to prepare automobile bumper materials
Method used
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[0026] The preparation method of special material of the present invention comprises the steps:
[0027] A. The non-metallic powder of the printed circuit board is crushed into a powder with a particle size of less than 400 mesh, the powder is dehumidified, a coupling agent is added, mixed, and the mixture is set aside;
[0028] B. Mix the mixture obtained in step A with polypropylene, rubber elastomer, linear low-density polyethylene and bismaleimide, melt, extrude and granulate to obtain the product.
[0029] If conventional additives such as antioxidants and light stabilizers are added, these additives are mixed with polypropylene, rubber elastomer, linear low-density polyethylene, and bismaleimide in step B, and then melt-extruded and granulated together Instantly.
[0030] The special material of the present invention is prepared by adopting the above-mentioned raw materials and preparation method, so that the glass fiber and epoxy resin in the non-metallic powder of the...
Embodiment 1
[0032] Raw material ratio: 2.2kg of copolymerized polypropylene, 0.4kg of POE (POE8003 of DuPont-Dow Chemical Company in the United States), 0.6kg of non-metallic powder (400 mesh) of printed circuit board, 1.8kg of linear low-density polyethylene (LLDPE), city Sell KH792 coupling agent 0.01kg, bismaleimide 0.01kg.
[0034] A. The non-metallic powder of the printed circuit board is crushed into a powder with a particle size of less than 400 mesh, the powder is dehumidified, a coupling agent is added, mixed, and the mixture is set aside;
[0035] B. Mix the mixture obtained in step A with polypropylene, polyolefin elastomer, linear low-density polyethylene and bismaleimide, melt, extrude and granulate to obtain the product.
[0036] The temperature of each section of the extruder (SLF-35B twin-screw extruder) is as follows:
[0037] Table 1: Molding temperature of each section of twin-screw extruder
[0038] first p...
Embodiment 2
[0040] Raw material ratio: copolymerized polypropylene PP2.7kg, POE (POE8003 from DuPont Dow Chemical Company, USA) 0.54kg, printed circuit board non-metallic powder (500 mesh) 0.36kg, linear low density polyethylene (LLDPE) 1.98kg, Commercially available KH792 coupling agent 0.01kg bismaleimide 0.01kg. The preparation method is the same as in Example 1.
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Abstract
The invention relates to the reapplication of non-metal material in printed circuit board of electronic waste products, in particular to the special materials of automobile bumper and the preparationmethod thereof, which belongs to the technological field of resource reproduction of electronic waste products. The special materials of automobile bumper are characterized in that the invention is prepared by the following weight ratio: 50-80 portions of polypropylene, 10-15 portions of non-metalpowder of printed circuit board, 10-20 portions of rubber elastomer, 40-60 portions of linear densitypolyethylene, 0.1-0.5 portions of bismaleimide and 0.1-0.5 portions of coupling agent; the fineness of the non-metalpowder of the printed circuit board is less than 400 meshes. The invention has theadvantages of simple preparation method of the materials thereof, excellent property and low cost and can fully meet the property requirements of middle and lower grade cars. At the same time, by applying non-metal materials of the waste printed circuit board to the car production industry, the value of resource recycling of the printed circuit board can be raised.
Description
technical field [0001] The invention relates to the reapplication of non-metallic materials in electronic waste printed circuit boards, in particular to special materials for automobile bumpers and a preparation method thereof, and belongs to the technical field of electronic waste recycling. Background technique [0002] With the rapid development of electronic technology, the upgrading of various electronic products is becoming more and more frequent. Basically, all electronic products contain printed circuit boards to varying degrees, and printed circuit boards in eliminated electronic products are mainly composed of electronic components, printed circuit board substrates, and solder connecting electronic components and printed circuit board substrates. After the printed circuit board is separated from electronic components and solder, the remaining printed circuit board substrate is broken to separate metal components such as copper, tin, lead, etc., and finally non-meta...
Claims
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Application Information
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