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Manufacturing process for cleaning Flash chip

A chip and cleaning solution technology, applied in the field of Flash chip manufacturing process, can solve problems such as affecting the data retention capability of storage devices, and achieve the effect of preventing cross-contamination

Inactive Publication Date: 2008-06-18
SEMICON MFG INT (SHANGHAI) CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the subsequent process, these ions will diffuse into the storage device and affect the data retention ability of the storage device

Method used

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  • Manufacturing process for cleaning Flash chip
  • Manufacturing process for cleaning Flash chip

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Experimental program
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Embodiment Construction

[0010] see figure 1 The Flash chip of the present invention includes a metal layer 1 , a dielectric layer 2 and a storage device 3 . The dielectric layer 2 is used to isolate the metal layer 1 and the storage device 3 .

[0011] In the flash chip cleaning process of the present invention, the chip is cleaned with a single-chip cleaning machine, and the cleaning liquid is drained after cleaning a chip and will not be reused.

[0012] The cleaning solution in the process of the present invention is a water-based cleaning solution. The cleaning solution used in the preferred embodiment of the present invention is weak alkaline cleaning solution ST250.

[0013] see figure 2 , the left side of the chart is the test result of cleaning with a single-chip cleaning machine with a weak alkaline cleaning solution ST250, and the right side is the test result of using a multi-chip cleaning machine with an alkaline cleaning solution ACT940 in the prior art . The abscissa is the number...

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Abstract

The invention provides a cleaning process of a Flash chip. The invention includes the following steps: the chip is cleaned by a single-chip washing machine and together with an alkalescent cleaning agent. Compared with the prior art, the Flash chip cleaning process of the invention adopts the single-chip washing machine to clean the chip and the cleaning agent is renewed after one chip is cleaned, thus effectively preventing an interactive contamination to the chips in the cleaning process. Furthermore, adopting the alkalescent cleaning agent can more thoroughly remove the polymers and ions left on the side wall of the surface grooves of chips and at the bottom of the chips, so as to prevent irons from diffusing into the internal parts of memorizing components to impact the operating performance of the components.

Description

technical field [0001] The Flash chip manufacturing process of the present invention, in particular, relates to the cleaning process of the Flash chip. Background technique [0002] The structure of the Flash chip includes metal layers, dielectric layers and storage devices. The dielectric layer is used to isolate the metal layer and the storage device. During the etching process, some polymer remains in the sidewall and bottom of the trench on the chip surface, so a wet cleaning process is provided after the etching process to remove the residual polymer. In the cleaning process, firstly, a plurality of chips are placed on a carrier device and immersed in a cleaning solution for cleaning. The most commonly used cleaning solution is alkaline cleaning solution. [0003] In the cleaning process, the cleaning solution is usually changed periodically after cleaning several batches of chips. Since a lot of polymers and ions will remain in the cleaning solution after a batch o...

Claims

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Application Information

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IPC IPC(8): H01L21/00
Inventor 杜学东曾坤赐陈玉文张弓
Owner SEMICON MFG INT (SHANGHAI) CORP
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