Bonding sheet for capacitor and method for manufacturing capacitor built-in printing wiring board

A technology for printed wiring boards and manufacturing methods, applied in the direction of multilayer circuit manufacturing, semiconductor/solid-state device manufacturing, electric solid-state devices, etc., to achieve cheap and stable manufacturing, and the effect of stabilizing electrostatic capacitance
CN101207971AInactive Publication Date: 2008-06-25NIPPON MEKTRON LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
NIPPON MEKTRON LTD
Publication Date
2008-06-25
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention provides a chip for forming a thin capacitor applied in parts built-in multi-layer flexible printed wiring boards and provides a method for manufacturing the parts built-in multi-layer flexible printed wiring boards using the chip. The invention also relates a bonding film for the capacitor and the manufacturing method, which is used for forming the capacitor by bonding electrodes on two surfaces of a dielectric layer, wherein, the capacitor is built-in printed wiring boards to form the bonding film. The bonding film is characterized in that: having a dielectric layer (1) which has high dielectric constant and is formed by flowing materials which can not occur accompanying substantive thickness changing and transforming at the pressure and temperature of the pressing time when the electrodes are boned onto the dielectric layer and has two surfaces with cohesive property; and bonding resin layers (2, 3), which have the fluidity to fill the surrounding of the electrodes and are arranged on two surfaces of the dielectric layer (1).
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Description

technical field

[0001] The present invention relates to an adhesive sheet (capacitor) and a method of manufacturing a printed wiring board with a built-in capacitor manufactured using the adhesive sheet. An adhesive sheet for a capacitor of a multilayer flexible printed wiring board and a method for manufacturing a printed wiring board using the same. Background technique

[0002] In recent years, there has been an increasing demand for miniaturization and high density of mounting substrates mounted in small electronic devices. As part of this, there has been a growing demand to mount CSPs (Chip Scale Packages), chip resistors, chip capacitors, and the like on the surface of wiring boards at high density, centering on mobile phones and the like.

[0003] In multilayer printed wiring boards loaded with components such as CSPs, capacitors such as decoupling capacitors are provided for various purposes, but due to the increase in mounting costs, component costs, and high-densi...

Claims

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