Laser cutting equipment
A laser cutting and equipment technology, applied in laser welding equipment, welding equipment, stone processing equipment, etc., can solve problems such as cracking of glass substrates
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[0010] The embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings.
[0011] Please refer to FIG. 1, the laser cutting device 100 provided by the embodiment of the present invention includes a carrying device 110, a laser cutting device 120, a pre-cutting device 130, and a cooling device 140.
[0012] The carrying device 110 has a carrying surface 112 for carrying the brittle material substrate 200 to be cut. The material of the brittle material substrate 200 can be a brittle material such as ceramic, glass, or quartz. Generally, the carrying device 110 can move along the Z-axis direction perpendicular to the carrying surface 112 thereof, and can also move and / or rotate in an X-Y plane parallel to the carrying surface 112.
[0013] The laser cutting device 120 is disposed opposite to the carrying device 110 and is located on the side of the carrying surface 112 of the carrying device 110. The laser cutting device...
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