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Formula of low-temperature sintering ceramics type diamond grinding head and preparation method

A technology for sintering ceramics and diamonds at low temperature, applied in metal processing equipment, grinding/polishing equipment, abrasives, etc. Low wear, high grinding performance and good wear resistance

Active Publication Date: 2018-05-04
SHENYANG LIMING AERO-ENGINE GROUP CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Ceramic sintering temperature is generally between 1200°C and 1500°C. Under this high temperature condition, the hardness of diamond will be greatly reduced, resulting in a decrease in the grinding performance of the grinding head. If a high-temperature sintered diamond grinding head is used for SiC ceramic composite cutting When the wear is fast, it cannot meet the high finishing requirements

Method used

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  • Formula of low-temperature sintering ceramics type diamond grinding head and preparation method

Examples

Experimental program
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Effect test

Embodiment 1

[0039] A kind of prescription of low-temperature sintered ceramic type diamond grinding head, each component that comprises and the parts by weight of each component are:

[0040] Vitrified binder: 10 parts

[0041] Dextrin powder: 10 parts

[0042] Walnut shell powder: 20 parts

[0043] Diamond powder: 100 parts

[0044] Described vitrified bond, each component that comprises and the mass percent of each component are:

[0045] Silica: 55%

[0046] Aluminum oxide: 25%

[0047] Strontium carbonate: 10%

[0048] Diboron trioxide: 10%

[0049] The particle size of the dextrin powder is 400 mesh, the particle size of the walnut shell powder is 400 mesh, and the particle size of the diamond powder is selected according to the processing requirements, generally according to the roughness value of the processed surface. In this embodiment, the roughness of the machined surface is 1.6, and the particle size of the diamond powder is 120 mesh.

[0050] A preparation method of a...

Embodiment 2

[0061] A kind of prescription of low-temperature sintered ceramic type diamond grinding head, each component that comprises and the parts by weight of each component are:

[0062] Vitrified binder: 9.5 parts

[0063] Dextrin powder: 10.5 parts

[0064] Walnut shell powder: 19 servings

[0065] Diamond powder: 105 parts

[0066]Described vitrified bond, each component that comprises and the mass percent of each component are:

[0067] Silica: 45%

[0068] Aluminum oxide: 35%

[0069] Strontium carbonate: 12%

[0070] Boron trioxide: 8%

[0071] The particle size of the dextrin powder is 400 mesh, the particle size of the walnut shell powder is 400 mesh, and the particle size of the diamond powder is selected according to the processing requirements, generally according to the roughness value of the processed surface. In this embodiment, the roughness of the machined surface is 1.6, and the particle size of the diamond powder is 120 mesh.

[0072] A preparation method of...

Embodiment 3

[0081] A kind of prescription of low-temperature sintered ceramic type diamond grinding head, each component that comprises and the parts by weight of each component are:

[0082] Vitrified binder: 10.5 parts

[0083] Dextrin powder: 9.5 parts

[0084] Walnut shell powder: 21 servings

[0085] Diamond powder: 95 parts

[0086] Described vitrified bond, each component that comprises and the mass percent of each component are:

[0087] Silica: 40%

[0088] Aluminum oxide: 30%

[0089] Strontium carbonate: 10%

[0090] Diboron trioxide: 10%

[0091] The particle size of the dextrin powder is 400 mesh, the particle size of the walnut shell powder is 400 mesh, and the particle size of the diamond powder is selected according to the processing requirements, generally according to the roughness value of the processed surface. In this embodiment, the roughness of the machined surface is 1.6, and the particle size of the diamond powder is 120 mesh.

[0092] A preparation method...

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Abstract

The invention discloses a formula of a low-temperature sintering ceramics type diamond grinding head and a preparation method and belongs to the field of mechanical cutting and manufacturing. The formula of the low-temperature sintering ceramics type diamond grinding head contains the following components in parts by weight: 9.5-10.5 parts of a ceramic bond, 9.5-10.5 parts of dextrin powder, 19-21parts of walnut shell powder and 95-150 parts of diamond powder. The preparation method comprises the following steps: adding water and uniformly mixing raw materials, stirring to obtain pasty materials, performing extrusion forming, and drying to obtain a ceramic type diamond grinding head blank; and sintering the ceramic type diamond grinding head blank at a temperature of 500-600 DEG C for more than or equal to 6 hours, thereby obtaining the low-temperature sintering ceramics type diamond grinding head. The low-temperature sintering ceramics type diamond grinding head prepared from the formula and by the method is high in wear resistance and small in cutting wear of the grinding head, the geometric dimension is stable in the machining process, and precision cutting requirements of SiCceramic composite materials can be met.

Description

technical field [0001] The invention relates to the field of mechanical cutting manufacturing, in particular to a formula and a preparation method of a low-temperature sintered ceramic diamond grinding head. Background technique [0002] In industries such as aerospace and energy, higher performance requirements are placed on high temperature structural materials. High temperature structural ceramics have attracted the attention of researchers because of their high temperature resistance. SiC ceramics have good high-temperature strength, high-temperature stability and high-temperature oxidation resistance, etc., but SiC ceramics alone have poor plastic deformation ability. After years of research, SiC ceramic composite materials can meet the functional requirements of various fields. [0003] SiC ceramic composite material is a new material used in engine structural parts. The Mohs hardness of SiC in the material is 9.5, which is between the hardness of corundum and diamon...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/52C04B35/622C04B35/63C04B35/636C04B35/64B24D3/00B24D3/14B24D3/34B24D18/00
CPCB24D3/00B24D3/14B24D3/342B24D3/346B24D18/0009C04B35/52C04B35/622C04B35/62204C04B35/6303C04B35/6316C04B35/6365C04B35/64C04B2235/656
Inventor 吴伟东王坤王红静顾盼邢宇
Owner SHENYANG LIMING AERO-ENGINE GROUP CORPORATION
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