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Polyamide hot-melt adhesive and shoe bonded by the same

A polyamide hot-melt adhesive and polypropylene technology, applied in adhesives, footwear, applications, etc., can solve problems such as not being able to meet the requirements of the back cover

Inactive Publication Date: 2011-04-20
SHANGHAI LIGHT IND RES INST +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] US5922831 synthesized a dimer acid polyamide resin with a softening point of 90-110°C by copolymerization, and blended and modified it with low-molecular polar wax and polyolefin elastomer to obtain a thermal resin suitable for shoe upper shaping. Melt glue, low temperature resistance -5°C, but the softening point does not exceed 125°C, which also cannot meet the requirements of the back glue

Method used

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  • Polyamide hot-melt adhesive and shoe bonded by the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0061] 4620 grams of dimer acid type polyamide (softening point 170 ° C, low temperature resistance -10 ° C, trade name KINGMIDE H-170HV, purchased from Taiwan Sanhe Co., Ltd.), 720 grams of polyolefin elastomer (trade name Engage 8200 , purchased from U.S. Dow Company), 660 grams of maleic anhydride grafted polypropylene (trade name BONP GPM200A, purchased from Ningbo Nengzhiguang New Material Technology Co., Ltd.) and 20 grams of antioxidant 1010 were added to the mixer (model GF300 , purchased from Zhangjiagang Tong Plastic Company), mixed with a stirring speed of 70 rpm for 1 hour, then added to a twin-screw extruder (model TES-35, purchased from Nanjing Ruiya Company), controlling the heating temperature of each section of the screw The temperature is about 175°C, extruded by screw, cooled, and pelletized to obtain hot melt adhesive slices. After the slices are dried in an oven at 100°C for 4 hours, they are melted and extruded in a single-screw extruder, and the extruded...

Embodiment 2

[0063] 3900 grams of dimer acid type polyamide (softening point 172 ° C, low temperature resistance -5 ° C, trade name TOHMIDE170, purchased from Japan Fuji Chemical Co., Ltd.), 600 grams of polyolefin elastomer (trade name Exact3024, purchased from Exact Sen Mobil Company), 500 grams of maleic anhydride grafted polypropylene (trade name BONP GPM200B, purchased from Ningbo Energy's Light New Material Technology Co., Ltd.) and 15 grams of antioxidant 264, with the same equipment as in Example 1 And process, the polyamide hot-melt adhesive strip for shoes with a diameter of 3.85±0.15mm is produced. The indicators of the rubber strips were tested, and the results are shown in Table 1.

Embodiment 3

[0065] 4000 grams of dimer acid type polyamide resin (softening point 171 ° C, low temperature resistance -10 ° C, trade name LR-PA-170, produced by Shanghai Liri Chemical New Material Co., Ltd.), 600 grams of polyolefin elastomer (commodity Name Tafmer DF740, purchased from Japan's Mitsui Corporation), 500 grams of maleic anhydride grafted polypropylene (trade name KTJ-1A, purchased from Shenyang Ketong Plastic Technology Co., Ltd.) and 20 grams of antioxidant 1010, used in the examples Using the same equipment and process as in 1, a polyamide hot-melt adhesive strip for shoes with a diameter of 3.85±0.15mm was produced. The indicators of the rubber strips were tested, and the results are shown in Table 1.

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Abstract

The invention provides a polyamide hot melt adhesive, which contains, by total weight, 50 to 90wt% dimer acid polyamide resin with a softening point of 160 to 220 DEG C, 5 to 25wt% polyolefin elastomer and 5 to 25wt% polypropylene grafted and modified by unsaturated carboxylic acid. The hot melt adhesive has the advantages of high softening point, good low-temperature flexibility, high adhesion strength, moderate hardness and high curing speed, as well as used in a temperature range of -20 DEG C to 100 DEG C, and is particularly suitable for lasting adhesive applying machinery. The invention also relates to shoes adhered by the polyamide hot melt adhesive.

Description

technical field [0001] The invention relates to hot-melt adhesive and its application, in particular to polyamide hot-melt adhesive and shoes bonded by it. Background technique [0002] China is the world's largest producer of footwear, with an annual output of 7 to 8 billion pairs of shoes. Adhesives are used in many processes in shoemaking. The stretch last uses hot melt adhesive to firmly bond the upper and the inner sole. The middle and back stretch last mainly uses strip polyamide hot melt adhesive. The strips of glue pass through the rubber hose of the automatic gluer, and the glue is applied between the mid-heel and the inner sole of the upper, and the bonding operation is completed within a few seconds. The polyamide rear upper adhesive for shoes requires good comprehensive properties, including high softening point, good adhesive strength and low temperature flexibility, fast curing, moderate hardness (Shore hardness greater than 40) and moderate melt viscosity. A...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J177/06A43D25/00
Inventor 祝爱兰顾庆锋王建平
Owner SHANGHAI LIGHT IND RES INST
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