Decompression drying device

Abstract

The invention provides a decompressing and drying device, which reduces the occupied area as a whole device and has a little heat influence on a substrate of non-heating at the same time of rapidly decompressing and drying. The decompressing and drying device (1) includes the function to decompress inside of a chamber (10) and a heating part (30) for heating the substrate (9) in the chamber (10).Therefore, the decompressing and drying device (1) is bale to heat the substrate (9) without carrying the substrate after decompressing and drying the substrate (9). Hence, the device can rapidly decompress and dry. In addition, since the heating process is in no need of other devices, the occupied area as a whole device can be reduced. Furthermore, the heating part heats the substrate (9) from updirection, so there is a little possibility that remaining heat at the time of non-heating influences on the substrate (9).

Description

technical field [0001] The present invention relates to a reduced-pressure drying device for performing reduced-pressure drying treatment on substrates such as semiconductor wafers, glass substrates for liquid crystal display devices, glass substrates for PDP (plasma display), and substrates for optical discs. Background technique [0002] Conventionally, there is known a reduced-pressure drying apparatus for performing a reduced-pressure drying process on a substrate coated with a thin film such as a photoresist in a substrate manufacturing process. The decompression drying device sucks and discharges the gas in the chamber through the exhaust pump after the substrate is carried into the given chamber, so as to decompress the inside of the chamber. As a result, the solvent components in the thin film on the substrate are vaporized, and the thin film is dried. The structure of the conventional vacuum drying apparatus is disclosed by patent document 1 (Japanese Unexamined Pa...

AI Technical Summary

Problems solved by technology

Therefore, it is difficult to quickly perform reduced-pressure drying treatment and heat treatment, and, as a whole, the occupied area of ​​the device becomes large.

[0007] In addition, when installing a heating mechanism in the chamber of a vacuum drying device, there is a concern that the residual heat of the heating mechanism will thermally affect the substrate even when it is not being heated.

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