Mold special for processing grinding silicon chip carrier

Abstract

The invention relates to a special mould for machining and grinding the carrier of silicon wafer, comprising a square vertical mould base, an upper mould plate, a lower mould plate and a bottom plate; wherein, a section of arc shaped upper teeth mould is arranged on the working face of the upper mould plate and a section of arc shaped lower teeth mould is arranged on the working face of the lower mould plate; the upper mould plate is arranged under the top edge of the mould base, a plurality of pilot holes are separately arranged on both sides of the mould base top edge, the two sides of the mould base can be used as the guide pillars, the top edge of the mould base is sleeved on the guide pillars passing the pilot holes, the bottom edge of the mould base is flat surface and elongated forwards to form the bottom plate, a locating pin is arranged on one side of the bottom plate and located at the outstretched pitch circle of the lower tooth mould; a centralized positioning rod is arranged on the bottom plate of the pitch circle center. The mould has the advantages that the accumulated error can be eliminated, the operation requirements can be effectively lowered, and the standardized processing can be performed on the basis of adopting the three points positioning and rotary sectional shearing, furthermore, the carrier with any diameter dimension can be machined and produced by using one set of equipment.

Description

【Technical field】 [0001] The invention relates to a processing mold, in particular to a special mold configured on a press for processing and grinding a silicon chip carrier. 【Background technique】 [0002] Carrying silicon wafer grinding carrier (also known as planetary wheel, carrier plate), is a gear that carries silicon wafers to revolve and rotate on the grinding disc. The carrier structure is circular, its upper and lower sides are planes, the outer contour is provided with teeth, and the middle part is provided with a plurality of holes for placing silicon wafers to be ground. When in use, a plurality of grinding carrier rings are arranged on the lower grinding disc of the grinding machine, and the carrier teeth are respectively meshed with the toothed walls of the inner and outer gears in the middle and outer periphery of the lower grinding disc. During the movement, under the forward and reverse drive of the inner and outer toothed walls, as well as the extrusion o...

AI Technical Summary

Problems solved by technology

Although the wire electric discharge cutting method adopts electronic programming and electronic control system to control cutting, it still has the following defects: the roughness of the cutting surface exceeds the standard, and the accumulated error of the tooth shape is large, which often affects the quality and yield of the silicon wafer to be ground

Its disadvantages are: 1. Imported materials must be selected. 2. Multiple blanks are stacked together for processing. Due to the influence of equipment and human factors, the cumulative error is large, the operator has high technical requirements, and the tolerance stability is poor, which is not conducive to standardized processing.

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