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Method for recycling copper from waste circuit board

A waste circuit board and copper recycling technology, which is applied in the direction of improving process efficiency, can solve environmental pollution and other problems, and achieve the effects of no pollution in the process, good social benefits, simple and feasible process

Inactive Publication Date: 2008-09-24
北京正康创智科技发展有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] The purpose of the present invention is to solve the problem of environmental pollution caused by recycling copper metal in waste printed circuit boards, and provide a consistent and pollution-free method for recycling copper metal (such as copper foil, copper wire, etc.) from waste circuit boards

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] 1) At 25°C, soak the copper foil with polyacrylate compound film material on the surface peeled off from the waste printed circuit board in chemically pure or above chemically pure ethylene glycol, and conduct the polyacrylate compound film material Swelling, the swelling time is about 3 hours;

[0021] 2) Stir the chemically pure or above-chemically pure ethylene glycol solution containing copper foil in step 1, and separate the polyacrylate compound film material from the copper foil under the action of mechanical force and fluid, and then utilize the difference in specific gravity, The polyacrylate compound film material and copper foil were filtered and recovered.

Embodiment 2

[0023] 1) At 50°C, soak the copper foil with the polyacrylate compound film material on the surface peeled off from the waste printed circuit board in n-butanol of chemical purity or above, and conduct the polyacrylate compound film material Swell, the swelling time is about 2 hours;

[0024] 2) Stir the chemically pure or above-chemically pure n-butanol solution containing copper foil in step 1, under the action of mechanical force and fluid, separate the polyacrylate compound film material from the copper foil, and then use the difference in specific gravity, The polyacrylate compound film material and copper foil were filtered and recovered.

Embodiment 3

[0026] 1) At 100°C, soak the copper foil with the polyacrylate compound film material on the surface peeled off from the waste printed circuit board in chemically pure or above chemically pure ethylene glycol, and treat the polyacrylate compound film material Swell, the swelling time is about 1 hour;

[0027] 2) Stir the chemically pure or above-chemically pure ethylene glycol solution containing copper foil in step 1, and separate the polyacrylate compound film material from the copper foil under the action of mechanical force and fluid, and then utilize the difference in specific gravity, The polyacrylate compound film material and copper foil were filtered and recovered.

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PUM

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Abstract

The invention belongs to recycling of waste printed circuit board, in particular to recycling method of copper metal including copper foil and copper wire from the waste printed circuit board. Firstly a copper metal with the surface of polymer film material, which is separated from the waste printed circuit board, is soaked in a swelling agent, and the copper metal matrix material and the polymer film material on the surface are separated by providing the good swelling environment and controlling the temperature change; The polymer film material and the copper metal are recycled in classification by utilizing the difference of specific gravity between the copper metal and the polymer film material. The method of the invention can carry out the effective and complete separation of the copper metal and the polymer film material on surface of the waste printed circuit board and the swelling agent can be repeatedly used; The recycling method of copper metal of the invention has the advantages of the simple and feasible process without pollution and having the good social efficiency, economical efficiency and environmental efficiency.

Description

technical field [0001] The invention belongs to the recycling of waste printed circuit boards, in particular to a method for recycling copper metal (such as copper foil, copper wire, etc.) from waste printed circuit boards. Background technique [0002] Printed circuit boards are generally composed of glass fiber cloth base material, metal copper (such as copper foil, copper wire, etc.), printed circuit, etc., and the surface of copper foil, copper wire, etc. in the printed circuit board has a layer of polymer film material. Metal resources contained in it: copper (12.5%), nickel (1%), tin (3%), lead (5%), gold (0.025%), silver (0.1%), palladium (0.01%); non-metallic Sources: Plastic, polyester, fiberglass, etc. The gold extracted from electronic waste can be directly obtained with gold (silver) content up to the No. 2 gold (silver) standard, and the purity of gold reaches 99%. Therefore, discarded circuit boards have become the target of companies and individuals to obtain...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22B3/16C22B15/00
CPCY02P10/20
Inventor 惠建斌马永梅
Owner 北京正康创智科技发展有限公司
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