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Method and device for printed circuit board capable of economizing agentia and reducing pollution

A technology for printed circuit boards and circuit boards, which is applied in the directions of printed circuits, printed circuit manufacturing, and secondary treatment of printed circuits, etc. It can solve problems such as EDTA wastewater pollution, reduce EDTA copper content, reduce production costs, and reduce consumption volume effect

Active Publication Date: 2008-10-01
恩达电路(深圳)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a kind of method that can save medicament and reduce pollution for the pollution problem of EDTA waste water when producing printed circuit board, and provide the special-purpose device that is used for this method at the same time

Method used

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  • Method and device for printed circuit board capable of economizing agentia and reducing pollution

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Experimental program
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Effect test

Embodiment 1

[0015] After the circuit board is taken out from the copper sinking reaction tank, use a manual compressed air spray gun to blow off the copper sinking liquid on the circuit board and drop it into the reaction tank. Before being treated with compressed air, for a 50cm x 60cm double-sided panel, the average amount of copper sinking liquid flowing down from the circuit board is about 40ml. The average amount of copper precipitation solution collected after treatment with compressed air is about 225 milliliters. The loss of copper sinking solution is reduced by about 5 times.

Embodiment 2

[0017] Install an automatic air injection device such as figure 1 shown. In the figure, there is a compressed air pipeline 2 above the copper sinking reaction tank 1, and a plurality of nozzles 3, light sources 4 and photosensitive probes 5 are installed on the compressed air pipeline. The intake valve 6 is a solenoid type compressed air intake valve, which is connected with the photosensitive probe 5 through electric wires and is controlled by it. When the circuit board 7 is taken out from the reaction tank 1, the light emitted from the light source 4 to the probe 5 is cut off, and the probe 4 immediately outputs a signal to the solenoid to open the intake valve 6, and the copper deposited on the circuit board 7 is removed by compressed air. The liquid is blown away and falls into the reaction tank 1. Before being treated with compressed air, for a 50cm x 60cm double-sided panel, the average amount of copper sinking liquid flowing down from the circuit board is about 40ml. ...

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Abstract

The present invention relates to the production technical field of a printed circuit board, in particular, relating to a method of saving reagent and reducing pollution under the production process of the printed circuit board, and its special device. The method and device utilizes compressed gas to blow the chemically deposited fluid with a copper attached on the surface of the printed circuit board when extracted from the chemically deposited reaction tank with copper, and after extracted, falling in the chemically deposited reaction tank with copper. The invention not only reduces the consumption quantity of the chemically deposited fluid with a copper, but also reduces the production cost, and relatively reducing the content of EDTA copper in the later waste water, achieving the aim of saving reagent and reducing pollution.

Description

technical field [0001] The invention relates to the production technical field of printed circuit boards, in particular to a method for saving chemicals and reducing pollution and a special device thereof during the production process of printed circuit boards. Background technique [0002] In the production process of printed circuit boards, there is a process of electroless copper deposition. The feature of this process is that it uses chemical reaction to deposit copper film on the surface of insulating material without external current. The equipment required by this method is simple and widely applicable. The method is not limited by the nature of the substrate, so metal or non-metal materials can be used. In addition, it is not limited by the surface geometry of the object to be plated, and a uniform thickness of the coating can be obtained, so it is widely used in the production of printed circuit boards. [0003] The reaction of chemical copper precipitation is ca...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/26H05K3/18H05K3/00
Inventor 陈荣贤张维睿
Owner 恩达电路(深圳)有限公司