Sealing apparatus, sealing method and encapsulation method of integrated circuit chip

Abstract

The invention discloses a molding device of an integrated circuit chip, comprising a bottom plate used for bearing a circuit board provided with the integrated circuit chip, and a top board used for being buckled with the bottom board and leading the circuit board and the bottom surface of the top board to joint closely; wherein, the top board is provided with at least one opening window corresponding to the position of the integrated circuit chip on the circuit board, thus leading the chip to be exposed completely so as to pour and mold conveniently; the invention also provides a molding method and a packaging method of the integrated circuit chip. The molding device of the integrated circuit chip has low investment and production cost, is economic and practical and realizes the packaging of the ultrathin chip; the thickness of colloid can be controlled under 50um and the molding shape of the chip is regular.

Description

technical field [0001] The invention relates to the field of integrated circuit chip packaging, in particular to an ultra-thin integrated circuit chip sealing device, sealing method and packaging method. Background technique [0002] The development trend of miniaturization, portable, and ultra-thin electronic systems has driven a sharp increase in the demand for miniaturization and flat chip packaging technology. At present, there are two main forms of bare chip technology: one is flip chip technology (Flip chip, FC chips are installed face-down on the PCB), and the other is COB (Chip On Board, COB chips are mounted directly on the PCB face-up) technology. [0003] Flip chip technology: Flip chip is also called flip chip, also known as "flip chip". Compared with COB, flip-chip (FC) has a chip structure and I / O terminals (solder balls) placed under the crystal in this packaging form. Since the I / O terminals are distributed on the entire chip surface, the packaging density a...

AI Technical Summary

Problems solved by technology

[0005] In order to solve the problems of colloidal height, colloidal shape, and cost that occur in packaging ultra-thin chips in the prior art, the purpose of the present invention is to propose a method for encapsulating integrated circuit chips, devices and packaging methods for integrated circuit chips, so as to control the colloid. The height difference between the highest surface height and the highest point of the state line arc is less than 50um, and the regular colloidal shape realizes low-cost integrated circuit chip packaging

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