Portable computer

Abstract

The invention provides a portable computer. A heat pipe (2) is changed into an arc shape from a bending shape through the improvement to a radiator of a CPU or a GPU chip (18), which ensures that an air convection extension heat exchange surface (4) (a fin) surrounds a fan (5) and opposites to an air outlet of an impeller, thereby greatly reducing the size and the weight of the radiator, improving the whole radiating effect, reducing the mounting limitation of the radiator, and realizing the standardization of the radiator series. Based on the heat emission improvement, the thickness and the weight of the computer are reduced, a shell (14) on the host is taken as a main frame, a mainboard (7), a battery and a hard disk are fixed on the main frame, which can realize the standardization of the portable computer series, reduce the cost, and be convenient for a user to make remodeling update.

Description

Technical field [0001] The invention relates to a portable electronic device, especially a portable computer which is composed of a flat panel display and a host computer, and the two can be folded together. Background technique [0002] The thickness of the portable computer is required to be thinner and thinner, the performance is continuously improved, and the heat generation is increasing, especially the heat generation of the central processing unit chip CPU and the image processor chip GPU is significantly increased, and heat dissipation has become a bottleneck for the performance improvement and development of the portable computer The heat sink is like a volute that cannot be thrown away on the back of a snail. It is pasted on the CPU or GPU chip. The volume of the heat sink has occupied a considerable space in the portable computer. The thickness of the portable computer is reduced, which is limited by the thickness of the heat sink. . [0003] The structure of the...

AI Technical Summary

Problems solved by technology

The problems of such a radiator are: the air outlet is concentrated, if it is blocked, the heat will not come out; the air driven by the fan passes through the ribs and is directly discharged without further use; the fan cover occupies most of the space of the fan, and is Empty, in order to reduce the space occupied by the windshield, the windshield is not a standard volute shape, so the air vortex loss is very large, and the air flow distribution at the air outlet is uneven, which is not good for heat dissipation

[0004] Due to the heat dissipation problem of the CPU or GPU chip, the radiators in the current notebook computers cannot be standardized in series, and the internal structure layout of the computer is ever-changing. Different series have completely different design layouts. Even if the same series, due to the function and performance improvement , a major change had to be made just because of thermal issues

This makes the product design cost high and the mold cost high, causing the performance of the notebook computer to be far inferior to that of the desktop computer, but the price is higher than that of the desktop computer.

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