Manufacturing method of insulation heat-conducting metal substrate

Abstract

The invention discloses a production method of an insulating and heat-conducting metallic parent material, which comprises the following steps: (1) a parent material of light metal alloy is provided and preprocessed, thus making the surface clean; (2) the parent material of light metal alloy is placed into an aqueous electrolyte solution so as to implement hard anodizing; wherein, the parent material is taken as an anode, a lead plate or a stainless steel are taken as a cathode, and voltage is exerted between the parent material and the cathode, thus generating a poriferous light metal oxide film on the surface of the parent material; and (3) the oxide film of the parent material is coated with a layer of highly heat-conducting gum, and the highly heat-conducting gum fills orifices of theoxide film. The production method of the insulating and heat-conducting metallic parent material forms the poriferous insulating oxide layer on the parent material, and the orifices are filled with the highly heat-conducting gum, and as the orifices have large contact surface with the highly heat-conducting gum. The production method of the insulating and heat-conducting metallic parent material can improve heat transmission speed more quickly, and has simple production process and easy implementation.

Description

【Technical field】 [0001] The invention relates to a method for manufacturing an insulating and heat-conducting metal substrate, in particular to a method for manufacturing an insulating and heat-conducting metal substrate that is applied to a light metal alloy substrate and is easy to manufacture. 【Background technique】 [0002] A good insulating and thermally conductive substrate must have high thermal conductivity, insulation, and low expansion coefficient. [0003] One of the traditional preparation methods of insulating and heat-conducting substrates is to print copper foil circuits on plastic substrates, such as FR4 printed circuit substrates (PCB), whose thermal conductivity is about 0.36W / (m K), and its disadvantage is that the thermal performance is relatively low. Difference. [0004] The second preparation method of the insulating and heat-conducting base material is to attach a metal plate such as an aluminum base material to the PCB base material, which is the s...

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Problems solved by technology

[0005] The third method of preparing insulating and heat-conducting substrates is to directly use sintered ceramic substrates such as AlN / SiC substrates, which have good insulation and thermal conductivity, but their size is limited to less than 4.5 square inches and cannot be used for large-area panels.

[0006] In addition, the fourth preparation method of the insulating and heat-conducting substrate is to pass oxygen between the copper plate and the ceramic and carry out a bonding reaction at a high temperature to obtain a direct copper bonding substrate (DBC, Direct Bonded Copper), which has both high thermal conductivity and Low thermal expansion and dielectric properties, but its operation and process temperature must be higher than 800 ° C

[0007] At present, there is no method for preparing insulating and heat-conducting metal substrates on light metal alloy substrates, such as magnesium alloys or aluminum alloys, using a novel thin-film coating technology that combines hard anodic oxidation and high thermal conductivity adhesive coating.