Plating solution formula of copper wire tin plating process and copper wire tin plating process

Abstract

The invention relates to the electric plating technical field, in particular to a bath formula for a copper wire tin plating process and the copper wire tin plating process completely utilizing the bath formula. In order to be differentiated from the conventional hot tinning, the invention is called the copper wire cold tinning according to the industry habit. Due to the adoption of the technical proposal of the invention, the tinning can be continuously completed without breaking copper wires, and the operation is simple, labor resources are saved and the production efficiency is high; moreover, the production speed of tinning copper wires are in line with the running speed of copper wires, which means that copper wires pass through the production line and immediately become tinning copper wires; the tinning copper wires made by the invention also have the advantages of uniform coating and compact structure, perfect performance; tin materials also belong to environment friendly materials, thereby not causing the environmental pollution and the wasting of resources, saving tins by 70 percent and lowering costs.

Description

Technical field: [0001] The invention relates to the technical field of electroplating, in particular to a plating solution formula for a copper wire tin plating process and a whole set of copper wire tin plating process using the plating solution formula. In order to distinguish the traditional hot tinning, it is called cold tinning of copper wire according to the industry practice. Background technique: [0002] It is self-evident that copper wire has a wide range of applications, especially in the field of electronic technology, copper wire is widely used, and it is a common material for wires and cables, electrical products and related products. In order to prevent the copper wire from being oxidized and corroded by substances such as sulfides and organic acids, a protective layer can be attached to the surface of the copper wire. [0003] At present, copper wire with a tin protective layer attached to the surface has been recognized by more and more merchants. As we a...

AI Technical Summary

Problems solved by technology

Under the condition that the principle of cold tin plating of copper wire is basically the same, the production process and equipment are different. Some copper wires of larger specifications are coated with a thick tin layer, and then stretched to form various specifications of tin plating. Tin-copper wire, such a tin-plated copper wire is affected to a certain extent whether it is the appearance or the uniformity of the tin layer. It is hard to say that it is perfect; , this process is cumbersome to operate, the most common phenomenon is still the tin powder falling off, if the copper wire with a small diameter is produced, it will also cause the problem of easy disconnection

[0006] In summary, the traditional hot-dip tinning process is difficult to promote due to various defects in principle and practical operation, which makes tinned copper wires unable to be continuously and efficiently produced, and causes a lot of waste of resources. It is difficult to adapt to the requirements of the market and conservation-oriented society, so it is urgent to improve

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