Sorting machine for memory IC detection

Abstract

The invention discloses an EMS memory IC detection grader, comprising a feeder box arranged at the front end of the grader, at least one collector box, a first material shifting device, and at least one testing device, one thermal testing chamber and a second material shifting device, which are arranged at the tail end of the grader, and a transfer device arranged among the feeder box, the collector box and the testing device to transport a plurality of EMS memory ICs to be tested or the tested EMS memory ICs among the feeder box, the collector box and the testing device. The second material shifting device transports a plurality of EMS memory ICs to be tested or the tested EMS memory ICs between the transfer device and the testing device. The testing device is provided with a testing circuit board which is provided with a plurality of test insert plugs; a pressure welding mechanism provided with a plurality of loader / unloader heads is arranged above the testing device to detect a plurality of EMS memory ICs to be tested at one time. A thermal testing chamber covers the external of the testing device so as to enable the testing device to carry out testing operation under high temperature. The EMS memory IC detection grader effectively shortens the operation time of each device and increases quantity of the EMS memory ICs to be tested by a large margin, thereby reaching the purpose of improving efficiency and yield.

Description

technical field [0001] The invention relates to an IC detection and classification machine, in particular to a memory IC detection and classification machine. Background technique [0002] At present, the ICs of semiconductor components are roughly divided into different types such as logic ICs, memory ICs, analog ICs and micro-component ICs. Taking logic ICs as an example, it is the central processing unit applied to the motherboard to be responsible for the central processing unit and other peripherals. The signal conversion or transmission of components, as well as the computing operations, have more complex functions, while the memory IC is simply used to store data and is installed on the module circuit board. The module circuit board is then assembled on the motherboard. Its function The nature is relatively simple, but regardless of any type of IC, after the production is completed, it must be tested to eliminate defective products and ensure product quality. [0003...

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Problems solved by technology

[0005] However, referring to Fig. 1 and Fig. 3, when the operator uses the above-mentioned IC testing and sorting machine to perform the testing operation of memory ICs, since each testing device 14 uses a test circuit board 144 for testing memory ICs, dozens of test sockets 145 are arranged. , and can bear dozens of memory ICs to be tested, this situation occurs that the described transfer device 16 only carries a single memory IC to be tested, so that the first and second material transfer devices 13, 15 must reciprocate dozens of times of material transfer, taking the test circuit board 144 with 32 test sockets 145 as an example, the transfer device 16 and the first and second material transfer devices 13 and 15 must be performed 32 times Carrying and material-moving actions, and the test device 14 must wait until the 32 test sockets 145 are loaded with the memory IC to be tested before performing the test operation. If it is a large IC with several test devices Inspection machine, the operation and waiting time of each device will be more cumbersome and time-consuming, and it will also greatly reduce the inspection capacity of memory ICs. Therefore, an IC inspection and sorting machine is not suitable for performing inspections of memory ICs.

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