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Electronic parts packages

A technology of electronic parts and components, which is applied in the field of packaging of electronic parts, can solve the problems of expensive substrates, achieve the effect of reducing size and effectively removing static electricity and noise

Inactive Publication Date: 2008-12-03
阿莫先思电子电器有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the substrate is made of AlN, the substrate is very expensive and it is difficult to properly form the tilt angle required to control the light in the LED package

Method used

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Examples

Experimental program
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Effect test

no. 1 example

[0068] Figure 6 is a cross-sectional view of the LED package according to the first embodiment of the present invention.

[0069] Figure 6 The illustrated LED package includes: a chip-type LED device 32; a lower ceramic substrate 35 on which the LED device 32 is mounted; an upper ceramic substrate 40 disposed on the lower ceramic substrate 35 and in a region where the LED device 32 is mounted therein. A cavity having a predetermined shape is included in the corresponding area; pattern electrodes 34 and 36 are formed on the lower ceramic substrate 35; on the inner surface of the cavity so as to surround the LED device 32 . A protrusion 44 a suspended from the upper end of the upper ceramic base 40 is formed on the upper end of the reflection plate 44 .

[0070] The lower ceramic substrate 35 may be any substrate as long as the LED devices 32 can be densely mounted on the substrate. For example, the lower ceramic substrate 35 may be made of alumina, quartz, calcium zircona...

no. 2 example

[0088] Figure 7 is a cross-sectional view of an LED package according to a second embodiment of the present invention. When the LED package structure according to the second embodiment is compared with the LED package according to the first embodiment, the second embodiment is different from the first embodiment in that the reflection plate 44 is connected to the anode electrode 34 .

[0089] The lower end of the reflection plate 44 is connected to the anode electrode 34 in order to prevent loss of light emitted from the LED device 32 . A method of integrating the reflection plate 44 and the anode electrode 34 is not specified and is easily understood by those skilled in the art without further explanation.

[0090] Because Figure 7 In the embodiment, the lower end of the reflecting plate 44 is connected to the anode electrode 34, so the second embodiment differs from the first embodiment in the structure of the anode electrode 34 and the cathode electrode 36.

[0091] re...

no. 3 example

[0094] Figure 8 is a cross-sectional view of an LED package according to a third embodiment of the present invention. When the LED package according to the third embodiment is compared with the LED package according to the second embodiment, the third embodiment differs from the second embodiment in the structure of the cathode electrode 36 and provides a metal part 52 in the LED package.

[0095] refer to Figure 8 , the cathode electrode 36 is horizontally formed in the mounting area of ​​the LED device formed on the upper surface of the lower ceramic substrate 35 . The cathode electrode 36 covers the upper surface of the heat transfer member 38 . One end of the cathode electrode 36 extends downward into the lower ceramic substrate 35 by a predetermined length in the vertical direction, and extends to the outer surface of the lower ceramic substrate 35 in the horizontal direction. Then, one end of the cathode electrode 36 extends downward along the outer surface of the l...

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Abstract

The present invention relates to an electronic part package capable of effectively radiating heat. A heat radiating member is buried below the mounting region of the light emitting device of the substrate so as to be separated from the mounting region of the light emitting device in a vertical direction, and is exposed to the lower surface of the substrate. A heat transfer member, which has thermal conductivity higher than that of the substrate, is formed between the mounting region of the light emitting device and the heat radiating member. Accordingly, since the substrate includes an effective heat radiating structure, it is possible to quickly radiate heat generated form the light emitting device.

Description

technical field [0001] The present invention relates to an electronic component package, and more particularly relates to an electronic component package capable of effectively dissipating heat to the outside. Background technique [0002] Light emitting diodes (hereinafter referred to as LEDs) are semiconductor devices capable of providing different colors. Light emitting sources of LEDs are formed of various compound semiconductor materials such as GaAs, AlGaAs, GaN, InGaN, and AlGaInP. Currently, semiconductor devices have been widely used as electronic components in the form of packages. [0003] Generally speaking, the criteria used to determine the performance of LED devices are color, brightness and intensity range of brightness. The performance of an LED device is determined by the compound semiconductor material used in the LED device. Furthermore, performance is significantly affected by the package structure on which the chip is mounted. [0004] Common lamp t...

Claims

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Application Information

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IPC IPC(8): H01L33/00H01L33/64H01L33/52
CPCH01L2924/01322H01L2224/48091H01L2224/48227H01L2224/49107
Inventor 李永一朴淙远赵允旻
Owner 阿莫先思电子电器有限公司
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