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Arrangement comprising at least one electronic component

A technology of electronic components and components, applied in the direction of electrical components, electrical solid devices, printed circuit components, etc., can solve problems such as leakage and short circuit

Active Publication Date: 2008-12-17
B2 ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although heat is transported well via the carrier to the heat sink by this measure and at the same time a sufficient breakdown strength is ensured, there is always the problem that undesired electrical leakage or short circuit

Method used

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  • Arrangement comprising at least one electronic component
  • Arrangement comprising at least one electronic component
  • Arrangement comprising at least one electronic component

Examples

Experimental program
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Effect test

Embodiment Construction

[0017] Embodiments of the present invention show combined cooling system and insulation system, especially for high voltage applications, such as high voltage amplifiers, controllable high voltage impedance and high power impedance, transistors, triacs, diodes or similar applications As electronic components 1 , they must on the one hand be well cooled and on the other hand must be insulated against voltages, especially very high voltages. At the same time structures are possible in which the carrier comprises at least one layer 2 of aluminum nitride or aluminum oxide. Other materials with correspondingly good thermal conductivity and high compressive strength can also be used. In the various illustrated exemplary embodiments, the carrier or the layer 2 forming the carrier is formed starting from the basic structure, ie essentially square without the recesses 5 shown, in the form of a plate. The carrier or the layer 2 forming it advantageously has a minimum edge length 6 of 1...

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PUM

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Abstract

The invention relates to an arrangement comprising at least one electronic component (1) and a cooling body (3) associated therewith and a support physically interposed between the electronic component (1) and the cooling body (3) and having at least one layer (2) with at least one material of an electric strength of at least 10 kV / mm and a thermal conductivity of at least 5 W / mK. At least one recess (5) and / or at least one protruding element is arranged in and / or on the layer (2) of the support and is configured in such a manner that it extends, along the surface of the layer (2) of the support, preferably all electrically possible pathways between the electronic component (1) and the cooling body as compared to the condition of the layer (2) of the support without the recess (5) and / or without the protruding element.

Description

technical field [0001] The invention relates to a device comprising at least one electronic component and a cooling body associated therewith, as well as a carrier arranged spatially between the electronic component and the cooling body, the carrier having at least one layer, the The layer comprises at least one material with a breakdown strength of at least 10 kV / mm and a thermal conductivity of at least 5 W / mK. [0002] Furthermore, the invention also relates to a layer, a carrier and / or a unit consisting of a carrier and a heat sink, which are suitable for such a device. Background technique [0003] In numerous electronic components there is the problem that on the one hand the heat generated during operation of the electronic components must be dissipated, but on the other hand the necessary breakdown strength, i.e. electrical insulation. In most materials with high electrical resistance, ie good breakdown strength, the thermal conductivity is so low that heat can onl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K9/00H05K1/05H01L23/36H01L23/373
CPCH01L23/367H01L23/3737H01L23/4334H01L2924/3011H01L2224/32225H01L2924/13033H01L2924/00
Inventor S·巴尔德奥夫R·布兰克
Owner B2 ELECTRONICS