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Electrostatic chuck

An electrostatic chuck and bump technology, which is applied in the manufacture of circuits, electrical components, semiconductors/solid-state devices, etc., can solve unfavorable helium heat conduction, uneven temperature distribution on the surface of wafer 1, limited gap between wafer 1 and insulating layer 2, etc. problem, to achieve the effect of uniform temperature distribution

Active Publication Date: 2011-04-06
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Due to the existence of electrostatic attraction, the gap between wafer 1 and insulating layer 2 is very limited, which is not conducive to the heat conduction of helium to wafer 1, resulting in uneven temperature distribution on the surface of wafer 1

Method used

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specific Embodiment 2

[0020] Specific embodiment two such as Figure 5 As shown, the plurality of bumps 7 can be distributed in a circle, distributed along a plurality of circles with the center of the insulating layer 2 as the center.

[0021] The surface shape of the bump 7 is one or more of the following shapes: circle, square, triangle, polygon.

[0022] The diameter of the bumps 7 may be 3 mm, the pitch may be 8 mm, and the height may be 0.04 mm. In a specific application, the diameter of the bumps 7 may be 2-4mm, the pitch may be 6-10mm, and the height may be between 0.03-0.05mm, which can be set according to the needs of the process.

[0023] The insulating layer 2 is made of ceramic material (AL203, ALN, etc.), and the DC electrode layer is buried in the insulating layer 2 by sintering or spraying during manufacturing. The upper surface of the insulating layer 2 is preferably sandblasted.

[0024] In the utility model, the upper surface of the insulating layer is designed to be concave-c...

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Abstract

The invention discloses a static chuck which comprises an insulation layer. The upper surface of the insulation layer is provided with a plurality of salient points that are equally distributed in the matrix form or circumference form, which is propitious for helium to enter the gap between a wafer and the insulating layer for realizing the heat transmission of the wafer and ensuring that the surface temperature of the wafer is evenly distributed. The static chuck is mainly applied to the process of the corrosion of a semiconductor and can improve engraving evenness of the wafer, can also be applied to the processing technology of other semiconductors.

Description

technical field [0001] The invention relates to semiconductor wafer processing equipment, in particular to an electrostatic chuck of the wafer processing equipment. Background technique [0002] In the integrated circuit (IC) manufacturing process, especially in the etching, physical vapor deposition (PVD) and chemical vapor deposition (CVD) processes, an electrostatic chuck (ESC for short) is generally used to fix, support and transport Wafer, to avoid movement or dislocation of the wafer during the process. The electrostatic chuck uses electrostatic attraction to fix the wafer, which has many advantages compared with traditional mechanical chucks and vacuum chucks. The electrostatic chuck reduces the unsuitable repair damage to the wafer caused by mechanical reasons such as pressure and collision in the process of using the traditional chuck; due to the use of electrostatic attraction without mechanical fixation, the effective processing area of ​​the wafer is increased; ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/683
Inventor 彭宇霖
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD