Unlock instant, AI-driven research and patent intelligence for your innovation.

Automatic alignment apparatus of integrated photon chip and array optical fiber

A technology of integrated photons and arrayed optical fibers, applied in the field of mechanical devices, can solve the difficulties of increasing multiple optical paths at the same time with high-precision alignment and coupling, and adjust mutual coupling interference, etc., to achieve multi-purpose equipment space, high-precision alignment, and Ease of use

Inactive Publication Date: 2009-01-21
CENT SOUTH UNIV
View PDF0 Cites 12 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the non-strictly orthogonal characteristics of different degrees of freedom in the six-dimensional motion platform make the inter-coupling interference of the dimension-by-dimensional position adjustment in the optical channel alignment process, which increases the difficulty of achieving simultaneous high-precision alignment and coupling of multiple optical paths. This requires the optimal layout and combination of the overall mechanical device

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Automatic alignment apparatus of integrated photon chip and array optical fiber
  • Automatic alignment apparatus of integrated photon chip and array optical fiber
  • Automatic alignment apparatus of integrated photon chip and array optical fiber

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0019] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0020] see figure 1 , figure 2 , image 3 and Figure 4 , the base plate 100 is provided with an intermediate platform 200, and the base plate 100 is provided with a first six-dimensional high-precision motion platform 300 and a second six-dimensional high-precision motion platform 400 symmetrically distributed around the intermediate platform 200, above the intermediate platform 200 A high-precision and general-purpose integrated photonic chip fixture 503 and a vacuum suction port 5031 are arranged. The structure of the first six-dimensional high-precision motion platform 300 is that a first X-axis axial motion platform 301 is provided on the bottom plate 100, and the first X-axis axis The moving platform of the moving platform 301 is connected to the fixed platform of the first Z-axis axial moving platform 302, and the first connecting bo...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an automatic align device for integrated photon chip and arrayed fibers, wherein a bottom plate (100) is provided with a central platform (200) and is provided with two six-dimension high accuracy movable platforms symmetrically at the left and right of the central platform (200). The invention is provided with two six-dimension high accuracy movable platforms and a compact and reasonable structure, thus is suitable for abutting and packing various plane waveguides demanding high accuracy aligning and is easy to fit external devices as IR-CCD, machine vision, adhesive deposit device, UV solidifier and the like. The invention has simple operation, large motion range and high accuracy.

Description

technical field [0001] The invention relates to a mechanical device suitable for automatic alignment of integrated photonic chips and arrayed optical fibers, in particular, it is suitable for six-dimensional high-precision alignment of integrated photonic devices such as optical splitters, optical fiber collimators, arrayed waveguide gratings, etc. Alignment and packaging mechanisms. Background technique [0002] Integrated photonic devices have outstanding advantages such as compact structure, small size, strong anti-interference ability, good performance consistency, stability and reliability, and easy automated mass production. In recent years, they have been widely used in optical communication backbone networks and fiber-to-the-home technologies for access networks. . The packaging of integrated photonic devices is to use the submicron precision motion platform to align, couple and fix the integrated photonic chip with the array fiber to achieve high performance of the...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G02B6/36
Inventor 段吉安廖平郑煜
Owner CENT SOUTH UNIV
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com