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Thru hole filling method, thru hole filling construction and thru hole manufacturing method

Active Publication Date: 2011-12-07
SEMICON MFG INT (SHANGHAI) CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The invention provides a through hole filling method, a through hole filling structure and a through hole manufacturing method, which solve the problems of difficulty in filling photoresist and high exposure energy consumption in the prior art through hole filling process

Method used

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  • Thru hole filling method, thru hole filling construction and thru hole manufacturing method
  • Thru hole filling method, thru hole filling construction and thru hole manufacturing method
  • Thru hole filling method, thru hole filling construction and thru hole manufacturing method

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Embodiment Construction

[0018] The through-hole filling method, the through-hole filling structure and the through-hole manufacturing method of the present invention select a dry film as the photoresist layer when forming the photoresist layer in the through-hole filling process, and form the dry film in a vacuum and low-pressure environment.

[0019] The through-hole filling method, the through-hole filling structure and the through-hole manufacturing method of the present invention are described in detail through preferred embodiments, so as to make the description of the through-hole filling method and the through-hole manufacturing method clearer.

[0020] refer to figure 1 As shown, the through hole filling method in the embodiment of the present invention includes the following steps,

[0021] Step s1, providing a substrate with through holes on the surface;

[0022] Step s2, sequentially forming a connection layer and a seed layer on the surface of the substrate;

[0023] Step s3, forming a ...

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Abstract

The invention discloses a through hole filling method, including the following steps: providing a substrate which has a through hole on the surface; developing a dry film on the surface of the substrate; exposing and developing the dry film so as to form an opening on the dry film; and filling the through hole from the opening of the dry film. The invention further discloses a through hole filling structure and a through hole formation method. The invention solves the problem that currently filling light-sensitive lacquer into a through hole with big height-depth ratio is difficult and consumes a big amount of energy during the exposition process, thus improving through hole filling efficiency.

Description

technical field [0001] The invention relates to a packaging process, in particular to a through-hole filling method, a through-hole filling structure and a through-hole manufacturing method in the packaging process. Background technique [0002] As we all know, packaging technology is actually a technology for packaging chips, which is necessary for chips. Because the chip must be isolated from the outside world to prevent the electrical performance from degrading due to the corrosion of the chip circuit by impurities in the air. On the other hand, packaged chips are also easier to install and transport. Since the quality of the packaging technology also directly affects the performance of the chip itself and the design and manufacture of the PCB (printed circuit board) connected to it, it is very important. Packaging can also be said to be a shell for installing semiconductor integrated circuit chips. It not only plays the role of placing, fixing, sealing, protecting chip...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/768H01L21/31H01L23/522
Inventor 靳永刚毛剑宏王孝远
Owner SEMICON MFG INT (SHANGHAI) CORP
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