A manufacturing process of ultra-thick copper pcb
A manufacturing process, ultra-thick copper technology, applied in the direction of printed circuit manufacturing, manufacturing printed circuit precursors, electrical components, etc., can solve the problem of no report on the production of ultra-thick copper PCB
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[0031] A manufacturing process of an ultra-thick copper PCB, comprising the steps of:
[0032] (1) Cutting: FR-4 base material is selected, the plate thickness is 1.6mm-1.7mm, and the copper thickness is 137um-138um;
[0033] (2) Drilling positioning;
[0034] (3) Graphic conversion;
[0035] (4) Graphical electroplating: thicken the copper thickness of the circuit through graphic electroplating, so that the circuit and the dry film are equal to facilitate the next dry film;
[0036] (5) Fading film etching;
[0037] (6) Soldering resistance: The board is made by printing oil twice, the first time a 43T screen is used, and after pre-baking, a 77T screen is used for the second printing, and the board is baked after normal rest;
[0038] (7) Curing after solder mask: Carry out segmental curing and bake at the highest temperature for 30-40 minutes;
[0039] (8) Adjust copper thickness;
[0040] (9) repairing holes;
[0041] (10) test;
[0042] (11) Shape repair;
[0043] ...
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