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LED lamp with heat radiation structure

A technology of light emitting diode and heat dissipation structure, which is applied to the semiconductor device of light emitting element, light source, light source fixing and other directions, can solve the problems of easy heat generation, noise generation, increase power consumption of light emitting diode lamps, etc., to achieve good heat dissipation effect, The effect of stable work

Inactive Publication Date: 2009-03-11
上海国增知识产权服务有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The radiator generally only dissipates heat outward by radiation, which has low efficiency and easily causes heat accumulation, which affects the luminous efficiency of LED lamps.
In order to strengthen the flow of air around the radiator and enhance its heat dissipation effect, a fan can be added to the radiator, but the fan itself is prone to generate heat and noise, and increases the power consumption of LED lamps, which also increases the cost

Method used

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  • LED lamp with heat radiation structure
  • LED lamp with heat radiation structure
  • LED lamp with heat radiation structure

Examples

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Embodiment Construction

[0014] like Figure 1-2 As shown, the LED lamp of the present invention is composed of an LED module 200 and a heat sink 100 for affixing the LED module 200 . The heat sink 100 is roughly hemispherical, and its outer diameter gradually decreases from the lower end to the upper end along the axial direction. The heat sink 100 includes a main body 10 , a plurality of cooling fins 20 extending outward from the outer surface of the main body 10 , and a housing 30 surrounding the lower half of the cooling fins 20 which has a larger outer diameter.

[0015] Please also refer to Figure 3 to Figure 6 The main body 10 has a heat absorbing portion 12 , a heat transfer portion 15 extending from one end of the heat absorbing portion 12 , and a connecting portion 18 . The connecting portion 18 extends from the other end of the heat transfer portion 15 opposite to the heat absorbing portion 12 , and exceeds the top of the heat sink 20 . The heat absorbing part 12 , the heat transfer par...

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Abstract

The invention discloses a light emitting diode lamp with a radiating structure, which comprises a light emitting diode module and a radiator that is used for paste-arranging and cooling the light emitting diode module, and the radiator comprises a cylindrical body that is contacted with the light emitting diode module, a plurality of radiating fins are arranged on an outer surface of the body, lateral borders of the radiating fins are mutually connected, and consequently a plurality of air channels that extend along the axial direction of the body are formed between the radiating fins surrounding the body. The light emitting diode lamp carries out good radiation on the light emitting diode module by conducting air flow through the radiating structure.

Description

technical field [0001] The invention relates to a light-emitting diode lamp, in particular to a light-emitting diode lamp with a heat dissipation structure. Background technique [0002] As a high-efficiency light source, light-emitting diodes have many characteristics such as environmental protection, high brightness, power saving, and long life, and have been widely used in various fields, such as street lamps and other lighting equipment. However, a large amount of heat is generated when the light-emitting diodes are working. If the heat is not dissipated in time, the light-emitting diodes may be overheated, resulting in a decrease in luminous efficiency. [0003] The traditional solution to the problem of heat dissipation of electronic components is usually to install a heat sink on the heat-generating electronic components. The heat sink includes a base plate closely contacting the electronic components, and a plurality of cooling fins arranged on the base plate. Gener...

Claims

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Application Information

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IPC IPC(8): F21V29/00F21V17/00F21Y101/02F21V29/77F21Y115/10
CPCF21V29/773F21V29/83F21K9/00F21V29/2293F21V29/2231
Inventor 肖旭华何立刘宜三
Owner 上海国增知识产权服务有限公司
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