Terminal device for digital subscriber line xDSL

Abstract

The invention provides an XDSL terminal device of a digital user line, which is applied to the technical field of electron. In the invention, an ESD protection module is connected between an interface and an earthing module for leading a high voltage static into the external ground by the ESD protection module. Compared with the ESD protection module connected between a central processing module and the earthing module in the prior art, the XDSL terminal device of a digital user line only needs to be added with a protection apparatus at the location of the interface for leading a static signal to be reflowed into the external earth and reducing the static voltage coupled at the location of sensitive pins, thereby being incapable of affecting the accurate location of the sensitive pins of a chip in the central processing module; besides, as the pins at the interface location are less, the effects of the distribution parameters of the protection apparatus to the signal quality of a product are reduced; simultaneously, the protection apparatus needed to be added are less, thus reducing the cost of the product. Anyhow, the XDSL terminal device of a digital user line ensures the product to successfully pass the ESD noise immunity test accessed by a market and also ensures the EMC property indexes of the product.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to digital subscriber line xDSL terminal equipment. Background technique [0002] In the field of electronics, the phenomenon of high-energy discharge currents at the input and / or output nodes of an integrated circuit (IC) due to the accumulation of electrostatic charge that can generate very high voltages (e.g., 10,000 volts or more) in an integrated circuit (IC) , that is, electrostatic discharge (ESD), which will cause the entire integrated circuit to fail or destroy the entire integrated circuit. Especially for the access terminal floating electronic products with digital subscriber line (xDSL) outdoor ports, in the electromagnetic compatibility (EMC) test for market access, it often occurs that the main chip, that is, the central processing unit (CPU) core has low immunity to interference. The phenomenon that ESD electrostatic contact discharge and air discharge immunity t...

AI Technical Summary

Problems solved by technology

[0005] The CPU main chip in electronic products has many pins, and there are many protective devices that need to be added, and the internal circuit of the chip is complicated and it is difficult to accurately locate the sensitive pins; the distribution parameters of the protective devices often also affect the signal quality of the product, causing transmission signal Incomplete; at the same time, too many protective devices will increase the cost of the product

In short, the electrostatic discharge protection circuit in the existing xDSL terminal equipment affects the ESD immunity test for market access, and cannot ensure the EMC performance index of the product

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