Organosilicon conductive adhesive

A technology of conductive adhesive and silicone, which is applied in the direction of conductive adhesives, adhesives, conductive materials dispersed in non-conductive inorganic materials, etc.

Active Publication Date: 2009-04-22
SHANGHAI PLASTICS RES INST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the aforementioned elasticity, softness and drop resistance all need to be further improved.

Method used

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  • Organosilicon conductive adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Put 50g of vinyl-terminated polydimethylsiloxane, 9g of trimethylsilyl-terminated poly(dimethylsiloxane-co-methylhydrogensiloxane), 20g of methyl styryl silicone , 1g of polymerization inhibitor ethynyl cyclohexanol, 0.1g of polyvinylsiloxane platinum complex catalyst and 5.6g of organic solvent decane were added to the mixer at room temperature, stirred and mixed at a speed of 120 rpm by the stirrer 25min, after mixing evenly, add 325g2-15μm flake silver powder and stir for 15min, then move to the roller gap of 0.1-1mm, the middle roller speed is 88 rpm, the speed ratio of rear roller: middle roller: front roller is 1: On a 3:9 three-roll machine, roll and mix three times continuously to prepare silicone conductive adhesive. The conductive adhesive has a storage period of half a year at 5°C. Heat curing at 160°C, 180°C and 240°C for 1.5 hours respectively. The performance of the product is: small piece thrust 2.5kgf, volume resistivity 2.5×10 -4 Ω·cm, the pencil har...

Embodiment 2

[0026] Except that the ingredient ratio changes to: 65g vinyl-terminated polydimethylsiloxane, 8g trimethylsilyl-terminated poly(dimethylsiloxane-co-methylhydrogensiloxane), 30g methyl Styryl silicone, 0.1g polymerization inhibitor ethynyl cyclohexanol, 0.01g methylvinylsiloxane platinum complex catalyst and organic solvent 10.3g No. 200 mineral spirits (commercially available). After the resin composition and the organic solvent were stirred for 30 minutes, 427 g of flake silver powder was added, and the stirring was continued for 20 minutes. The conductive adhesive was heat-cured at 160°C, 180°C and 240°C for 2 hours respectively, and other operating steps were the same as in Example 1. As a result, the product performance was: small piece thrust 1.5kgf, volume resistivity 4.8×10 -4 Ω·cm, pencil hardness 5.5B.

Embodiment 3

[0028] Except that the ingredient ratio is changed to: 40g vinyl-terminated polydimethylsiloxane, 10g trimethylsilyl-terminated poly(dimethylsiloxane-co-methylhydrogensiloxane), 10g ethyl Hydrogen-containing silicone oil, 2g polymerization inhibitor ethynyl cyclohexanol, 0.2g polyvinylsiloxane platinum complex catalyst and 10g organic solvent decane. After the resin composition and the organic solvent were stirred for 20 minutes, 180 g of flake silver powder was added, and the stirring was continued for 10 minutes. The conductive adhesive was heat-cured at 160°C, 180°C and 240°C for 1 hour respectively, and the other operation steps were the same as in Example 1. As a result, the product performance was: small piece thrust 3.0kgf, volume resistivity 5.6×10 -4 Ω·cm, pencil hardness 5.5B.

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Abstract

The invention relates to an organic silicon conductive adhesive which comprises a resin composition, an organic solvent and argent powder, wherein the resin composition comprises: (1) 40 to 65weight percent of ethenyl end capped polydimethylsiloxane; (2) 8 to 10 weight percent of trimethyl silicyl end capped poly(dimethyl siloxane-co-dimethyl silicone); (3) 10 to 30 weight percent of polysiloxane silicone oil with hydrogen-silicon bonds and/or ethenyl; (4) 0.1 to 2 weight percent of a polymerization inhibitor; and (5) 0.01 to 0.2 weight percent of a platinum complex catalyst; the weight ratio of the resin composition to the argent powder is 10-40 to 90-60; and the use amount of the organic solvent is 5 to 10 percent of the weight of the resin composition. The preparation process of the organic silicon conductive adhesive is as follows: the resin composition is stirred for 20 to 30 minutes, is added with the argent powder, is stirred for 10 to 20 minutes, is transferred to a three-roller machine, and is continuously rolled and mixed for three times to prepare the organic silicon conductive adhesive. The storage life of the organic silicon conductive adhesive is half a year at the temperature of 5 DEG C below zero . The organic silicon conductive adhesive is subjected to thermal curing for 1 to 2 hours at the temperatures of 160 DEG C, 180 DEG C and 240 DEG C respectively. As a result, a product has the following performances: flake thrust force is between 1.5 and 3.0 kgf; volume resistivity is less than or equal to 6X10< -4 > Omega.cm; and pencil hardness is less than 6 B.

Description

1. Technical field [0001] The invention relates to a silicone conductive glue, more precisely, the invention relates to a silicone-based conductive glue. 2. Background technology [0002] The silicone conductive adhesive is at least composed of a silicone resin, conductive metal particles and an organic solvent. With the development of the electronic industry, the amount of conductive adhesive is gradually expanding, and it has become an indispensable material for the components of electronic machines. The purpose of silicone conductive adhesive is mainly aimed at quartz crystal resonators, such as the bonding of surface metal electrodes and package metal electrodes. Surface-mounted components are made using surface-mounting technology, which is widely used in the fields of mobile phones, digital cameras, automobiles, computers, color TVs and video recorders. Quartz crystal components are small in size, light in weight, and stable in performance, and the consumption of its...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08K3/08B29B7/80C08J3/24C09J183/07C09J9/02H01B1/22C08L83/05
Inventor 边丽娟张灵云徐子仁杨菲
Owner SHANGHAI PLASTICS RES INST CO LTD
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