Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Encapsulating material composition of LED

A technology of light-emitting diodes and packaging materials, which is applied in the direction of electrical components, circuits, and other chemical processes. It can solve the problems of low refractive index, low light-emitting efficiency of LEDs, and inapplicability, so as to improve the refractive index and solve the problem of insufficient thermal stress dissipation. highly acceptable effect

Active Publication Date: 2012-06-20
IND TECH RES INST
View PDF2 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is to provide a formulation of packaging materials for light-emitting diodes (LEDs), which can overcome the low refractive index of traditional packaging resins for light-emitting diodes, resulting in total reflection and low LED light extraction efficiency, and the current high-refractive materials. It is not applicable to the phenomenon of LED packaging materials, so it can be widely used in solid-state light-emitting components such as transparent packaging materials for LEDs

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Encapsulating material composition of LED
  • Encapsulating material composition of LED
  • Encapsulating material composition of LED

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] Formula Table:

[0037]

[0038]Wherein the bifunctional epoxy resin is Diglycidyl ether of Bisphenol A (Diglycidyl ether of Bisphenol A) (EPON-828, purchased from Shell chemical. company), and the aromatic ring-containing bifunctional mercaptan hardener is 4, 4'-dimercapto diphenyl sulfide (4,4'-Thiobisbenzonethiol) (abbreviated as TBT, purchased from TCI Co. company), the aliphatic four-functional mercaptan hardener is tetrakis (3-mercaptopropionic acid) pentapentetate Alcohol (pentaerythritol tetrakis (3-mercaptopropionate)) (PTT-3MP, purchased from TCI Co. company), the catalyst is Quaternary phosphonium bromide (U-cat 5003, purchased from San-apro limited. company) , antioxidants are hindered phenolic antioxidants (Chinox1076, available from Sigma-Aldrich Co.) and organic phosphite antioxidants (Tris (nonylphenyl) phosphate, 1178, available from Sigma-Aldrich Co.).

[0039] Put the epoxy resin (EPON-828), hardener (TBT) and catalyst (U-cat 5003) [0.2wt% (EPON-8...

Embodiment 2

[0043] Formula Table:

[0044]

[0045] The difference between embodiment 2 and embodiment 1 is that the difunctional epoxy resin wherein is propanediol F diglycidyl ether (Diglycidyl ether of Bisphenol F) (EPON-830, purchased from DIC company), in embodiment 2 It does not contain antioxidants, and the ratio of TBT and PTT-3MP is changed, the ratio of TBT is increased, and the ratio of PTT-3MP is decreased.

[0046] Put the epoxy resin (EPON-830), hardener (TBT+ PTT-3MP) and catalyst (U-cat 5003) in the formula table into the reactor, stir and mix at 60°C for 75 minutes, then put the uniformly mixed The resin material was defoamed in vacuum for 20 minutes, and then the above material was poured into a mold, heated in an oven at 80°C for 1 hour, and then heated at 160°C for 2 hours to complete the hardening.

[0047] The packaging material sample prepared in Example 2 was measured in the same manner as in Example 1, and the obtained results are listed in Table 1.

Embodiment 3

[0049] Formula Table:

[0050]

[0051]

[0052] The difference between Example 3 and Example 2 is that the dithiol hardener containing aromatic ring structure is bis-[2,2'-bis(mercaptomethyl)-1,1-bisphenylmethane sulfide] (Bi- [2,2'-bis(mercaptomethyl)-1,1-biphenylmethlene sulfide]) (Biphenyl dithiol for short), synthesized by the inventor).

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
refractive indexaaaaaaaaaa
refractive indexaaaaaaaaaa
refractive indexaaaaaaaaaa
Login to View More

Abstract

The invention provides an encapsulation material composition of a light emitting diode. The encapsulation material composition comprises the following components (a) about 100 weight portions of liquid bifunctional group epoxy resin, wherein the content of aromatic nucleus accounts for 40 to 50 weight percent; (b) about 55 to 120 weight portions of hardener, wherein the hardener at least comprises a bifunctional group mercaptan hardener with an aromatic nucleus structure and a fatty series tetrad-functional group mercaptan hardener; the content of the aromatic nucleus in the hardener accountsfor 10 to 50 weight percent; the content of sulphur accounts for 20 to 35weight percent; and (c) about 0.05 to 0.5 weight portion of catalyst. The encapsulation material composition has high refractive index, can be applied to a high-efficient sold luminous element and improves light emergence efficiency.

Description

technical field [0001] The invention relates to a packaging material composition, in particular to a transparent packaging material composition with a high refractive index, which can be used in a solid-state light-emitting component to improve light extraction performance. Background technique [0002] In recent years, light emitting diodes (LED for short) have been widely used, and the demand for high brightness is increasing day by day. The overall luminous efficiency of the LED is mainly affected by the diode chip, the form of the structure and the packaging material. At present, the internal luminous efficiency of the diode chip has reached more than 90%, but the light extraction efficiency of the LED is only 30%. This is because the LED chip and The current transparent packaging materials have large differences in refractive index, so the light emitted by the LED chip will be totally reflected when passing through the packaging material, and then the light will be conf...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C09K3/10C08L63/02C08K5/37H01L23/29
Inventor 许嘉纹李巡天陈凯琪
Owner IND TECH RES INST
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com