Polyamide resin composition and molded article

A technology of polyamide resin and composition, which is applied in the direction of flat products, applications, household appliances, etc., can solve problems such as flashing and poor crystallization, and achieve excellent low bending performance, excellent bendability, and improved thin-wall formability Effect

Active Publication Date: 2009-05-13
MITSUBISHI ENG PLASTICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, even if this technology is used, the mold temperature needs to be 130°C or higher during the molding of the frame, and there are still problems of flashing and poor crystallization.

Method used

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  • Polyamide resin composition and molded article
  • Polyamide resin composition and molded article
  • Polyamide resin composition and molded article

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～9 and comparative example 1～16

[0074] (1) The making of resin composition pellets:

[0075] With the composition shown in Tables 1 to 3, each component except the fibrous filler (C1) was weighed, mixed in a drum, and then obtained from a twin-screw extruder "TEM35B (drum consisting of 10 zones) produced by Toshiba Machine Co., Ltd. ” into the base and let it melt. Then, the component (C1) was side-fed into the seventh zone counted from the side of the hopper to make resin composition pellets. The temperature setting of the extruder was uniformly 280°C.

[0076] (2) Evaluation of flexural strength, flexural modulus, and pendulum impact strength

[0077]

[0078] The pellets of each resin composition obtained by the above method were dried at 80°C for 48 hours, and then using an injection molding machine "100T" manufactured by FANUC LTD. Seconds, cooling time 15 seconds, VP switch when filling about 95% resin, keep pressure in the range of no flash, up to 620kgf / cm 2 Hold for 25 seconds to form an ISO t...

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Abstract

Disclosed is a polyamide resin composition for portable electronic devices, which is excellent in mechanical strength, thin shape formability, crystallinity and warping property. Specifically disclosed is a polyamide resin composition containing 30-80% by weight of a polyamide MP (A) and 20-70% by weight of a polyamide resin (B) having a melting point not less than 245 DEG C (with the total amount of them being 100% by weight). The polyamide resin composition further contains, as a filler (C), a fibrous filler (C1) as an optional component and a plate-like filler (C2) as an essential component, and the content ratio (C1):(C2) is from 0:10 to 9:1. The total amount of the filler (C) is 30-250 parts by weight relative to 100 parts by weight of the total of the polyamide MP (A) and the polyamide resin (B). The polyamide MP (A) is a polyamide resin obtained by a polycondensation reaction between a mixed diamine, which contains 90-50% by mole of meta-xylylenediamine and 10-50% by mole of para-xylylenediamine, and an alpha, omega-linear aliphatic dibasic acid and / or an aromatic dibasic acid.

Description

technical field [0001] The present invention relates to a polyamide resin composition and a molded article, in particular to a polyamide resin composition and molding that are excellent in mechanical strength, thin-wall formability, crystallinity, and bendability, and are suitable for thin-wall flat plate-shaped portable electronic device parts Taste. Background technique [0002] Portable electronic devices such as PDAs, portable game consoles, and mobile phones are often dropped due to movement. Therefore, especially in outer packaging parts such as housings, the impact of dropping is an important characteristic. In the case where the thickness of the product can be increased, in addition to using non-reinforced polycarbonate resin or ABS resin excellent in impact resistance, a resin composition composed of these resins and a small amount of filler can also be used. [0003] Among portable electronic device parts, there is sometimes a need for a flat plate-shaped part tha...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L77/00C08K7/00C08L77/06
CPCC08L2205/14C08K7/02C08K7/00C08L77/00C08L77/06C08L2205/16C08L2205/02C08L2666/20C08K3/013B29D7/00C08J5/00
Inventor 熊泽辉久森本馨
Owner MITSUBISHI ENG PLASTICS CORP
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