Standard mechanical interface equipment with microparticle adsorption pad
A technology for adsorbing pads and particles, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems affecting the yield rate of products in the semiconductor process environment, increasing the time and frequency of cleaning machines, and reducing machine running time, etc. To achieve the effect of shortening the cleaning time, increasing the running time, and increasing the effective production capacity
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[0019] Hereinafter, in conjunction with the accompanying drawings, a standard mechanical interface chip loader (SMIF-Indexer) is taken as an example to further illustrate the present invention.
[0020] Please refer to figure 1 , Which is a schematic diagram of the structure of the SMIF chip loader. The SMIF chip loader 200 includes a base 202 on which a filter device 204 is arranged, and the flow of air flow under the action of the filter device 204 is indicated by the arrow in the figure. The SMIF wafer cassette 100 is placed on the machine of the SMIF wafer loader 200, and the wafer cassette or wafer is removed by the wafer cassette opening mechanism 206. When the SMIF wafer cassette 100 is raised or lowered, particles generated due to friction between components will accumulate on the surface of the base 202 of the SMIF wafer loader 200. It can be seen from the figure that, under the influence of the filtering device, particles will rise and fall on the surface of the wafer, ...
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