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Standard mechanical interface equipment with microparticle adsorption pad

A technology for adsorbing pads and particles, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems affecting the yield rate of products in the semiconductor process environment, increasing the time and frequency of cleaning machines, and reducing machine running time, etc. To achieve the effect of shortening the cleaning time, increasing the running time, and increasing the effective production capacity

Inactive Publication Date: 2009-06-24
SEMICON MFG INT (SHANGHAI) CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, due to the friction between the SMIF wafer loader and the parts of the SMIF wafer cassette, particles will be generated and accumulated inside the SMIF wafer loader and the bottom of the SMIF wafer cassette. Under the influence of the machine filter, the accumulated particles will be raised
The raised particles will fall on the surface of the wafer, especially the bottom part of the SMIF wafer box is the most polluted, which will affect the semiconductor process environment and product yield; at the same time, the SMIF wafer loader and SMIF wafer box contaminated by particles Mutual contamination between the two increases the time and frequency of cleaning the machine and reduces the running time of the machine

Method used

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  • Standard mechanical interface equipment with microparticle adsorption pad
  • Standard mechanical interface equipment with microparticle adsorption pad
  • Standard mechanical interface equipment with microparticle adsorption pad

Examples

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Embodiment Construction

[0019] Hereinafter, in conjunction with the accompanying drawings, a standard mechanical interface chip loader (SMIF-Indexer) is taken as an example to further illustrate the present invention.

[0020] Please refer to figure 1 , Which is a schematic diagram of the structure of the SMIF chip loader. The SMIF chip loader 200 includes a base 202 on which a filter device 204 is arranged, and the flow of air flow under the action of the filter device 204 is indicated by the arrow in the figure. The SMIF wafer cassette 100 is placed on the machine of the SMIF wafer loader 200, and the wafer cassette or wafer is removed by the wafer cassette opening mechanism 206. When the SMIF wafer cassette 100 is raised or lowered, particles generated due to friction between components will accumulate on the surface of the base 202 of the SMIF wafer loader 200. It can be seen from the figure that, under the influence of the filtering device, particles will rise and fall on the surface of the wafer, ...

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Abstract

The invention discloses a standard mechanical interface (SMIF) equipment with a particulate absorption pad. The equipment is provided with a particulate absorption pad which is attached to a particulate accumulation area to adsorb the particles left on the area so as to avoid the flying particles falling on the wafer surface and impacting the semiconductor manufacturing process environment and the product yield; at the same time, the pad can avoid the mutual pollution among the equipments which are polluted by particles to reduce the machine station cleaning time and frequency; the pad can be timely replaced based on the particulate adsorption condition of the particulate absorption pad, so as to shorten the machine cleaning time, greatly enhance the running time of the machine station and increase the effective production capacity.

Description

Technical field [0001] The present invention relates to a standard mechanical interface (SMIF) device, in particular to a standard mechanical interface (SMIF) device that can reduce particle pollution. Background technique [0002] In the semiconductor manufacturing process, the surrounding particles or the particle contamination generated during the manufacturing process will directly affect the yield of the wafer. Therefore, in order to reduce particle contamination and improve wafer yield, the rapid development of standard mechanical interface (SMIF) systems has not only promoted the automation of semiconductor wafer manufacturing, but also reduced particle drop during storage and transfer of wafers in the semiconductor process. Opportunity to the chip. The SMIF system mainly includes three parts: a standard mechanical interface wafer pod (SMIF-Pod), which is used to transfer or store wafers (WaferCassette); a tiny environment, which uses ultra-pure gas to surround the wafer l...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
Inventor 庄忠华李启建
Owner SEMICON MFG INT (SHANGHAI) CORP