Measuring method for concentration of organic additive in plating solution

A technology of organic additives and measurement methods, applied in the direction of material electrochemical variables, etc., can solve the problems of complex process and time-consuming, and achieve the effect of small measurement deviation, low instrument accuracy and experimental operation requirements

Inactive Publication Date: 2009-07-01
深圳市合力泰光电有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The purpose of the present invention is to provide a simple, quick and small deviation method for the determination of the concentration of organic additives in the electroplating solution

Method used

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  • Measuring method for concentration of organic additive in plating solution
  • Measuring method for concentration of organic additive in plating solution
  • Measuring method for concentration of organic additive in plating solution

Examples

Experimental program
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Embodiment 1

[0033] This embodiment illustrates the method for measuring the concentration of organic additives in the electroplating solution of the present invention.

[0034] (1) The electroplating solution to be tested is an aqueous solution, which contains 6.00ml / L inhibitor (19280 produced by Mai Demei), 70g / L CuSO 4 ·5H 2 O, 100g / L of H 2 SO 4 , 50ppm hydrochloric acid.

[0035] (2) Blank plating solution A is an aqueous solution containing 70g / L of CuSO 4 ·5H 2 O, 100g / L of H 2 SO 4 , 50ppm hydrochloric acid.

[0036] (3) In addition to the inhibitors containing 2ml / L, 4ml / L, 6ml / L, 8ml / L, 10ml / L, 12ml / L, and 14ml / L respectively, the other components and concentrations of the seven standard plating solutions A Both have the same composition as the blank plating solution A.

[0037] 2) Preparation method of porous mesh platinum electrode

[0038] Dip the titanium sheet in 1mol / L hydrochloric acid, react at 85°C for 10min, and clean the surface. Clean in water for 10min un...

Embodiment 2

[0045] This embodiment illustrates the method for measuring the concentration of organic additives in the electroplating solution of the present invention.

[0046] (1) The electroplating solution to be tested is an aqueous solution, which contains 2.50ml / L brightener (19241 produced by Maidemi), 70g / L CuSO 4 ·5H 2 O, 100g / L of H 2 SO 4 , 50ppm hydrochloric acid.

[0047] (2) Blank plating solution A is an aqueous solution containing 70g / L of CuSO 4 ·5H 2 O, 100g / L of H 2 SO 4 , 50ppm hydrochloric acid.

[0048] (3) In addition to the brighteners containing 0.6ml / L, 1.2ml / L, 1.8ml / L, 2.4ml / L, 3.0ml / L, and 3.6ml / L respectively, other components of the six standard plating solutions B And its concentration is the same as the composition of blank plating solution A.

[0049] 2) Preparation method of porous mesh platinum electrode

[0050] Dip the titanium sheet in 1mol / L hydrochloric acid, react at 85°C for 10min, and clean the surface. Clean in water for 10min under u...

Embodiment 3

[0057] This embodiment illustrates the method for measuring the concentration of organic additives in the electroplating solution of the present invention.

[0058] 1) Reagents:

[0059] (1) The electroplating solution to be tested is an aqueous solution, which contains 6.00ml / L of inhibitor (19280 produced by Maidemi), 2.50ml / L of brightener (19241 produced by Maidemi), and 70g / L of CuSO 4 ·5H 2 O, 100g / L of H 2 SO 4 , 50ppm hydrochloric acid.

[0060] (2) Blank plating solution A is an aqueous solution containing 70g / L of CuSO 4 ·5H 2 O, 100g / L of H 2 SO 4 , 50ppm hydrochloric acid.

[0061](3) In addition to the inhibitors containing 2ml / L, 4ml / L, 6ml / L, 8ml / L, 10ml / L, 12ml / L, and 14ml / L respectively, the other components and concentrations of the seven standard plating solutions A Both have the same composition as the blank plating solution A.

[0062] (4) Blank plating solution B is an aqueous solution containing 35ml / L of inhibitors and 70g / L of CuSO 4 ·5H 2 ...

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Abstract

A test method for the concentration of organic additive in electroplating solution comprises: comparing the peak potential of an organic additive in an object electroplating solution with a standard curve of the organic additive, to determine the concentration of the organic additive in the object electroplating solution, wherein the standard curve of the organic additive reflects the relationship between the concentration and the peak potential of the organic additive in the object electroplating solution, and the peak potential is tested by cyclic volt-ampere dissection method or cyclic pulse volt-ampere dissection method. The test method on the concentration of organic additive in electroplating solution is simple and fast with low error.

Description

technical field [0001] The invention relates to a method for measuring the concentration of an organic additive in an electroplating solution. Background technique [0002] In the case of copper electroplating, nickel gold electroplating, etc., in order to obtain better electroplating effects, organic additives are usually added, and the organic additives generally include inhibitors and brighteners. The inhibitor and the brightener can adjust the deposition rate of the coating metal, so that the coating metal is deposited at a stable rate, thereby obtaining a uniform and bright coating. Therefore, in the electroplating process, controlling the concentration of the organic additive in the electroplating solution is one of the keys to obtain a good coating. [0003] The prior art has disclosed the method of controlling the organic additives in the electroplating bath by the cyclic voltammetric stripping (CVS) method [D.Tech andC.ogden, J.Electrochem.Soc.125,194(1978)], which...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N27/48
Inventor 沙宗云张玉梅
Owner 深圳市合力泰光电有限公司
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