Multilayer flexible printed circuit board and method of manufacturing the same

A flexible printing and circuit board technology, applied in the direction of multi-layer circuit manufacturing, secondary processing of printed circuits, reinforcement of conductive patterns, etc. Yield rate, reduction of grounding resistance, reduction of height difference

Active Publication Date: 2009-07-01
TAIZHOU RUNWEI MACHINERY
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The steel reinforcement 2' of the above-mentioned multi-layer flexible printed circuit board needs to be grounded, and it is connected to the copper foil 11' of the circuit board 1', and there is a cover film 12' between them. Since the cover film 12' has a height, it is conductive

Method used

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  • Multilayer flexible printed circuit board and method of manufacturing the same
  • Multilayer flexible printed circuit board and method of manufacturing the same
  • Multilayer flexible printed circuit board and method of manufacturing the same

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Embodiment Construction

[0015] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0016] see image 3 and Figure 4 , is a preferred embodiment of the multilayer flexible printed circuit board in the present invention, and the multilayer flexible printed circuit board includes a circuit board and a steel reinforcement 2 . The circuit board is formed by bonding a plurality of single-layer circuit boards. Each single-layer circuit board includes copper foil, a cover film and a base material. The copper foil forms the circuit of the circuit board, and the cover film is hot-pressed on the copper foil. On the circuit, in order to protect the circui...

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Abstract

The invention provides a multilayer flexible printed circuit board and a manufacturing method thereof. The multilayer flexible printed circuit board comprises a circuit board and a grounded conductive reinforcement, wherein, the circuit board is formed by a plurality of single layer flexible printed circuit boards which bond together, each single layer flexible printed circuit board is provided with copper foil and a cover membrane which is positioned on the copper foil, wherein, a windows is welded on the cover membrane of the outer layer of the multilayer flexible printed circuit board and corresponds to the grounding position needing welding and conductive reinforcement; a copper-plating block is welded on the single layer of flexible printed circuit board and corresponds to the grounding position needing welding and conductive reinforcement, the copper-plating block protrudes out of the window of the cover membrane; and the conductive reinforcement is conducted with the copper-plating block through a conductive adhesive. The multilayer flexible printed circuit board can decrease the height difference between the conductive reinforcement grounding position and the cover membrane, reduces the height of the circuit board and the conductive reinforcement which are attached with each other through a conductive adhesive, reduces the grounding resistance of the conductive reinforcement, and improves the yields of the product.

Description

【Technical field】 [0001] The invention relates to a multilayer flexible printed circuit board and a manufacturing method thereof. 【Background technique】 [0002] The multi-layer flexible printed circuit board is formed by adding an adhesive between layers of a single-sided flexible printed circuit board or a double-sided flexible printed circuit board, and hot pressing to cure the adhesive to achieve firm bonding between the layers. With the development of miniaturization and light weight of various electronic equipment, it is required to have small size, high heat resistance, low resistance, good shielding effect, flexible printed circuit board with superior bending performance and multi-function. In order to ensure the bending performance of multilayer flexible printed circuit boards, copper plating with hole patterns is generally used. In order to ensure the hardness and stability of multilayer flexible printed circuit boards SMT (Surface Mount Technology, surface mount t...

Claims

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Application Information

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IPC IPC(8): H05K3/24H05K3/46
Inventor 黄国华庞道成
Owner TAIZHOU RUNWEI MACHINERY
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