Laser processing method and laser machining apparatus

A laser processing method and laser processing technology, applied in laser welding equipment, metal processing equipment, welding equipment, etc., can solve the problems of inability to separate, excessive ablation of trimming, and inability to completely eliminate debris, so as to avoid excessive ablation. , Improve the degree of exclusion, the effect of good cutting effect

Inactive Publication Date: 2009-07-08
SHENZHEN MUSEN TECH
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AI Technical Summary

Problems solved by technology

[0003] 1. The heat-affected range of the slit of the processed material is large, and the range and effect of gas cooling are limited, so there will be excessive ablation around the cut edge;
[0004] 2. After some materials are laser cut, the cutting edges are re-adhesive during the cooling process after melting, and cannot be separated, so the cutting effect cannot be achieved.
[0005] 3. The debris at the cutting place cannot be completely removed, which affects the cutting quality

Method used

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  • Laser processing method and laser machining apparatus
  • Laser processing method and laser machining apparatus
  • Laser processing method and laser machining apparatus

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Embodiment Construction

[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0023] Please refer to figure 1 As shown, the laser cutting method of Embodiment 1 of the present invention includes the following steps:

[0024] Step S101, fixing the material to be processed in the container on the workbench.

[0025] figure 2 It is a schematic structural diagram of the first embodiment of the equipment used in the laser processing method of Embodiment 1 of the present invention, as figure 2 As shown, the container 1 fixed on the workbench ...

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Abstract

The invention discloses a laser processing method, comprising the following steps: materials to be processed are fixed in a container arranged on a working platform; liquid is injected into the cavity of the container, so that the materials to be processed are soaked in the liquid; laser processing is carried out on the materials soaked in the liquid. The invention also discloses a laser processing device. In the invention, the materials to be processed are placed in the liquid for laser processing, firstly due to the cooling effect of the liquid, heat affecting of the laser on the processing part is reduced during the process of laser processing, thus achieving good cooling effect, moreover, over-ablation of the laser on the materials is avoided; in addition, the materials can be prevented from being rebound during the cooling process after the materials are melted and the situation that materials can not be separated from each other is avoided; moreover, as the liquid is taken as auxiliary medium of the laser processing, removal extent of the material fragments is improved and good cutting effect is achieved.

Description

technical field [0001] The invention relates to the field of laser processing, in particular to a laser processing method and laser processing equipment. Background technique [0002] With the continuous development of laser technology, the application field of laser is more and more extensive, and laser processing is one of the largest fields, which includes laser welding, laser cutting, surface modification, laser marking, laser drilling and micromachining, etc. In the existing industry, laser processing is widely used in automobiles, electronics, electrical appliances, aviation, machinery manufacturing and other fields due to its incomparable advantages. However, the existing laser processing technology mostly relies on the thermal effect of the laser to achieve the processing purpose, so the negative effect brought by the thermal effect is inevitable. For example, laser cutting is to irradiate the processed material with the laser beam after focusing, and the light ener...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/00B23K26/14B23K26/38
Inventor 彭信翰汤海林杨伟
Owner SHENZHEN MUSEN TECH
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