Clearing device of particles foreign matter

Abstract

The invention discloses a particle foreign object removing device, which comprises a horizontal rail, two supports and at least one air blowing dust removing apparatus, wherein the two supports are vertical to the horizontal rail and connected with two ends of the horizontal rail respectively; the supports can be connected to the device and slide in the vertical direction; and the air blowing dust removing apparatus is connected with the horizontal rail and can slide along the horizontal rail. The particle foreign object removing device is fixed on production equipment for semiconductor products, and the air blowing dust removing apparatus can slide in the horizontal and vertical directions to blow different positions of the products on the production equipment for the semiconductor products so as to blow away particles on the surfaces of the products and reduce fraction defective of the products.

Description

technical field [0001] The invention relates to a device for removing particles, in particular to a device for removing particles and foreign objects on the surface of products in the electronic semiconductor industry. Background technique [0002] With the advancement of technology, all kinds of electronic products have penetrated into our lives, and most of these electronic products are semiconductor chips. Especially in recent years, due to the rapid development of the semiconductor industry, the manufacture of integrated circuits has been carried out towards larger chips and smaller line widths, in order to enhance the functions of integrated circuits of the same size and reduce the cost per unit of use. . However, semiconductor devices, especially high-density integrated circuits, are easily damaged by various pollutions. During the manufacturing process of semiconductor components, many particles generated from pipe walls, valve parts, filter paper, etc. enter the pr...

AI Technical Summary

Problems solved by technology

The traditional semiconductor production process uses wet cleaning technology to remove contamination particles on the wafer surface. This process requires the use of a large number of harmful compounds, causing hazards to workers and environmental pollution. In addition, due to the ultra- Pure water consumption accounts for about 60% of ultrapure water consumption in semiconductor factories, resulting in waste of water resources and increasing production costs of enterprises

However, the equipment in the existing manufacturing process does not have a special and effective device for removing particles on semiconductor products.

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