Compositions, methods and systems for polishing aluminum oxide and aluminum oxynitride substrates
A technology for compositions and substrates, applied in polishing compositions, polishing compositions containing abrasives, chemical instruments and methods, etc., and can solve problems such as damage
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Embodiment 1
[0033] A 2.5 g aliquot of the 40% phosphoric acid solution was added to 997 g deionized water with stirring. To this solution was added 1000 g of colloidal silica (40% solids, average particle size about 110 nm) with stirring. The pH was adjusted to 2.0 with 10% HCl solution. The resulting solution contained a final phosphoric acid concentration of 0.05%.
Embodiment 2
[0035] A control slurry was prepared as described in Example 1 except that the phosphoric acid was omitted. Adjust the pH to 2.3.
Embodiment 3
[0037] A 1.40 g aliquot of the 100% phosphonoacetic acid solution was added to 998 g deionized water with stirring. To this solution was added 1000 g of colloidal silica (40% solids, average particle size about 110 nm) with stirring. The pH was adjusted to 2.17 with 10% HCl solution. The resulting solution contained a final phosphonoacetic acid concentration of 0.07%.
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