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Cleaning member, delivery member with cleaning function, and method of cleaning substrate processing apparatus

A substrate processing device and a technology for cleaning parts, which are applied in the directions of cleaning methods using tools, cleaning methods and utensils, chemical instruments and methods, etc., can solve the problems of inability to peel off adhesive substances, a lot of labor, and adhesive contamination.

Inactive Publication Date: 2009-08-05
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, the following problems will arise: the operating rate of the substrate processing apparatus will decrease, and a lot of labor will be required to clean the substrate processing apparatus.
[0005] As mentioned above, the method of cleaning and removing foreign matter with a cleaning member having an adhesive substance is excellent as a method for effectively removing foreign matter, but there may be a problem that the adhesive substance is too firmly bonded to the cleaning part and Cannot be peeled off, and the adhesive residue on the clean part will cause pollution instead
However, in this cleaning wafer, the foreign matter is retained by the space portion of the light spot pattern to remove the foreign matter, so only the foreign matter having a particle diameter of several tens of microns can be removed.
It is difficult to sufficiently remove submicron-sized fine foreign matter

Method used

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  • Cleaning member, delivery member with cleaning function, and method of cleaning substrate processing apparatus
  • Cleaning member, delivery member with cleaning function, and method of cleaning substrate processing apparatus

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0108] A polyimide film (manufactured by Kaneka, Apical NPI25-NPS) was cut so that the apparent surface area was 100 cm 2 , performing an oxygen plasma etching treatment (A) on one side of the film to obtain a cleaning layer having a plurality of protrusions with a columnar structure on the surface.

[0109] Oxygen plasma etching treatment (A), is the plasma etching treatment that utilizes oxygen to carry out, adopts following condition to implement: that is, the distance between the electrodes of plasma generator is 10cm, RF power supply, oxygen flow 300sccm, discharge power density is 0.78W / cm 2 , the processing time is 600 seconds, and the discharge energy is 468W·sec / cm 2 .

[0110] Regarding the obtained cleaning layer, the specific surface area of ​​the cleaning layer, the density of the protrusions of the columnar structure on the surface of the cleaning layer, the aspect ratio of the protrusions of the columnar structure, the length of the protrusions of the protrusi...

Embodiment 2

[0112] A polyimide film (manufactured by Kaneka, Apical NPI25-NPS) was cut so that the apparent surface area was 100 cm 2 , performing an oxygen plasma etching treatment (B) on one side of the film to obtain a cleaning layer having a plurality of protrusions with a columnar structure on the surface.

[0113] The oxygen plasma etching treatment (B) is a plasma etching treatment using oxygen gas, and is carried out under the following conditions. That is, the distance between the electrodes of the plasma generator is 10cm, the RF power supply, the oxygen flow rate is 300sccm, and the discharge power density is 0.78W / cm 2 , the processing time is 300 seconds, and the discharge energy is 234W·sec / cm 2 .

[0114] Regarding the obtained cleaning layer, the specific surface area of ​​the cleaning layer, the density of the protrusions of the columnar structure on the surface of the cleaning layer, the aspect ratio of the protrusions of the columnar structure, the length of the protr...

Embodiment 3

[0116] A polyimide film (manufactured by Kaneka, Apical NPI25-NPS) was cut so that the apparent surface area was 100 cm 2 , performing an oxygen plasma etching treatment (C) on one side of the film to obtain a cleaning layer having a plurality of protrusions with a columnar structure on the surface.

[0117]The oxygen plasma etching treatment (C) is a plasma etching treatment using oxygen gas, and is carried out under the following conditions. That is, the distance between the electrodes of the plasma generator is 10cm, the RF power supply, the oxygen flow rate is 20sccm, and the discharge power density is 0.07W / cm 2 , the processing time is 6600 seconds, and the discharge energy is 462W·sec / cm 2 .

[0118] Regarding the obtained cleaning layer, the specific surface area of ​​the cleaning layer, the density of the protrusions of the columnar structure on the surface of the cleaning layer, the aspect ratio of the protrusions of the columnar structure, the length of the protru...

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Abstract

A cleaning member that is free from staining at cleaning sites, being capable of simple and easy, unfailing, satisfactory removal of minute foreign matter, preferably foreign matter of submicron level; a delivery member with cleaning function including the cleaning member; and a method of cleaning a substrate processing apparatus with the use of the delivery member with cleaning function. There is provided a cleaning member comprising a cleaning layer furnished on a major surface thereof with multiple protrusions of columnar structure, wherein the protrusions of columnar structure have an aspect ratio of 5 or greater.

Description

technical field [0001] The present invention relates to a cleaning member for removing fine foreign substances, a conveying member with a cleaning function, and a cleaning method for a substrate processing apparatus using the conveying member with a cleaning function. More specifically, the present invention relates to a cleaning member for removing fine foreign matter from substrates and devices that avoid fine foreign matter such as semiconductors, flat panel displays, printed substrates, and substrate processing equipment, and a conveyor with a cleaning function having the cleaning member. Components, and a cleaning method of a substrate processing apparatus using the transport component with a cleaning function. Background technique [0002] In semiconductors, flat panel displays, printed circuit boards, and other manufacturing equipment and inspection equipment, various substrate processing equipment that avoids foreign matter, each conveying system performs conveyance ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B08B1/00H01L21/304
CPCH01L21/67046C23C16/4407B08B7/0028B08B1/00B08B1/14B08B1/10H01L21/302H01L21/304
Inventor 菅生悠树寺田好夫宇圆田大介并河亮吉田良德前野洋平
Owner NITTO DENKO CORP
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