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Large-breadth jointless splicing precise laser drilling device

A technology of seamless splicing and laser drilling, used in laser welding equipment, welding equipment, metal processing equipment, etc., can solve the problems of many process parameters, immature process, short design cycle, etc., and achieve the effect of broad application prospects.

Inactive Publication Date: 2009-08-19
SUZHOU DELPHI LASER
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  • Abstract
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Problems solved by technology

The entire design cycle is short, the process is not mature enough, and there are many process parameters

Method used

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  • Large-breadth jointless splicing precise laser drilling device

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Embodiment Construction

[0018] Laser drilling belongs to the category of material removal processing. Using the characteristics of high laser power density to focus it, the processed material is heated, melted and vaporized instantly, and the molten material is expelled by the residual pressure of the steam to form holes. That is to use the spot shape of the laser to repeatedly drill holes at the same position. The light from the laser is expanded and shaped into parallel light (to facilitate finer focusing), and then rotates the mirror in two directions to form a plane scan. Then focus on the focal plane (the surface of the workpiece) through an appropriate focusing lens. Where there is a pattern, the laser Q switch is turned on to perform light drilling at a high frequency (20KHz) repetition rate.

[0019] like figure 1 As shown, the large-format seamless splicing precision laser drilling device includes a laser 1, a beam expander 2, a vibrating mirror 3 and a focusing mirror 4. The output end of ...

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Abstract

The invention provides a large breadth seamless splicing precision laser perforating device, which comprises a laser, a beam expanding lens, a polarizer and a focusing mirror; the output end of the laser is provided with the beam expanding lens, and the output end of the beam expanding lens is provided with the polarizer; the output end of the polarizer is connected with the focusing mirror; and beams emitted by the laser are transmitted into the beam expanding lens which then outputs parallel beams, the polarizer performs perfect reflection on the parallel beams, the focusing mirror performs focusing, and focal points of the parallel beams are distributed on a workpiece to be processed on a vacuum adsorption platform. The perforating breadth of the laser perforating device can reach 20 inches, and the number of holes is 5 million; the laser perforating device completes processing group holes of which the diameter is between 30 and 120 mu m and the depth is between 0 and 80 mu m on a steel plate or die steel with high efficiency and high precision in several hours, and the position order of the holes can be irregular; and as for perforation processing in large breadth, the optical effect cannot detect splicing seams.

Description

technical field [0001] The invention relates to a laser drilling device, in particular to a large-format seamless splicing precision laser drilling device. Background technique [0002] At present, there are the following methods for mold punching [0003] 1) Chemical etching method: first draw a piece of film with a drawing, prepare chemical corrosion drugs according to the mold material, and then perform corrosion for several days to form cylindrical holes; then perform multi-process cleaning and dry with equipment. The process is relatively mature, but there are many processes, the design cycle is long, and the corrosive liquid needs to be processed, so the product is not reproducible. [0004] 2) Mechanical drilling method: use a diamond ball or drill bit to press or drill holes on a CNC drilling machine or machining center. The drill bit is fragile and cannot be replaced after being damaged halfway, resulting in the scrapping of the entire product, contact with proces...

Claims

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Application Information

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IPC IPC(8): B23K26/00B23K26/064B23K26/382
Inventor 赵裕兴余建华
Owner SUZHOU DELPHI LASER
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