Metal coin stamp embedded with RFID electronic tag and manufacturing technique thereof

Abstract

The invention discloses a metal coin (stamp) embedded with a RFID electronic tag and a manufacturing technique thereof. The metal coin (stamp) comprises a metal coin (stamp) base body and a RFID embedding body, wherein, a blind hole is preformed on the metal coin (stamp) base body, the RFID embedding body is embedded into the blind hole, and the upper surface of the RFID embedding body embedded into the blind hole is kept on the same plane with the surface of the metal coin (stamp) base body; the manufacturing technique is that the RFID electronic tag is put into a closed shell made of non-metal material to form the RFID embedding body, and part plan of the blind hole is pressurized when the RFID embedding body is put into the blind hole of the metal coin (stamp), so that the embedding body is firmly bonded with the metal coin (stamp); then, color printing is carried out on the surface of the metal coin (stamp) which is embedded with the embedding body. The invention ensures the surface of the RFID electronic tag not to be covered by metal; meanwhile, the appearance effect of the metal coin (stamp) is not affected, so that the anti-counterfeiting property of the metal coin (stamp) can be improved.

Description

technical field [0001] The invention relates to the technical field of coinage, in particular to the anti-counterfeiting technology of metal coins (chapters), in particular to a metal coin (chapter) inlaid with an RFID electronic tag and a manufacturing process thereof. Background technique [0002] At present, the anti-counterfeiting of metal coins (chapters) is mainly reflected in the excellent production process and strict quality control to ensure the qualified products. Common anti-counterfeiting methods such as words, edge printing, and oblique wire teeth. Other cutting-edge and well-known anti-counterfeiting methods in the world include: Canadian commemorative coin laser holographic technology, which directly applies laser holographic technology to the production process of metal coins (chapters). The maple leaf on the laser holographic maple leaf gold coin is made of high-resolution The dot-matrix holographic molding technology makes the leaf surface of the maple le...

AI Technical Summary

Problems solved by technology

If the RFID tag is directly placed inside the metal coin (chapter), that is, the metal completely wraps the RFID tag, this method has the greatest shielding of the signal of the RFID tag, so this method is rarely used; if a sandwich structure is used, that is, in the metal Preform a through hole or blind hole on the coin (chapter), put the RFID tag directly into the through hole or blind hole, and then use non-metallic materials to fix the RFID tag directly in the through hole or blind hole, although this method can Reduce the impact of metal on the RFID tag signal, but this method is easy to cause the impact of non-metallic materials on the RFID tag, so as to damage the RFID tag, and this method uses a large number of non-metallic materials, if the surface of the non-metallic material is not treated , will greatly affect the appearance of metal coins (chapters). At the same time, non-metallic materials are exposed on the surface for a long time, and they are easily damaged if they are affected by external environments such as high temperature and high humidity.

Images