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Method for manufacturing multilayer electronic component

A technology of electronic components and manufacturing methods, which is applied to the manufacture of capacitors, fixed capacitance parts, electrical components, etc., can solve the problems of high equipment costs, complicated procedures, waste of materials, etc., and achieve the effect of easy automation of pressurization

Inactive Publication Date: 2013-05-01
TDK CORPARATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in this method of interposing a release sheet between the two, it is necessary to prepare these release sheets separately in addition to the green sheet, and the process is complicated.
[0004] In addition, preparation and disposal of the release sheet every time the laminated body is pressed is wasteful in terms of material, and there may be an environmental problem.
In addition, the replacement of the release sheet also needs to be automated, so there is a problem of high equipment costs

Method used

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  • Method for manufacturing multilayer electronic component
  • Method for manufacturing multilayer electronic component
  • Method for manufacturing multilayer electronic component

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach

[0022] First, an overall configuration of a laminated ceramic capacitor will be described as one of the embodiments of the laminated electronic component manufactured by the method according to the embodiment of the present invention.

[0023] Such as figure 1 As shown, the laminated ceramic capacitor 2 of the present embodiment has a capacitor body (element body) 4 , a first terminal electrode 6 , and a second terminal electrode 8 . The capacitor blank 4 has internal electrode layers 12 which are alternately laminated between inner dielectric layers 10 .

[0024] The capacitor body 4 has outer dielectric layers 14 on both end faces in the lamination direction. One of the internal electrode layers 12 laminated in a zigzag pattern is electrically connected to the inner side of the first terminal electrode 6 formed on the outer side of the first end portion of the capacitor body 4 . Furthermore, the other internal electrode layer 12 laminated in a staggered manner is electrica...

no. 2 Embodiment approach

[0051] In the second embodiment of the present invention, after laminating figure 2 Before the die 25 shown, only the outer green sheet 14a1 to be laminated on the lowermost side is dried in advance under different conditions from the other green sheets 14a2, 10a, 14a3, and 14a4. That is, the outer green sheet 14a1 is dried under drying conditions in which the adhesive force of the outer green sheet 14a1 becomes weaker than that of the other green sheets 14a2, 10a, 14a3, and 14a4. By changing the drying conditions in this way, the outer green sheet 14a1 can also be made weaker in adhesive force than the other green sheets 14a2, 10a, 14a3, and 14a4.

[0052] Specifically, only the outer green sheet 14a1 is previously dried at a higher drying temperature and / or for a longer drying time than the other green sheets 14a2, 10a, 14a3, and 14a4. More specifically, the dielectric slurry was dried at about 90° C. for 5 seconds to form a green sheet. Other configurations and effects a...

no. 3 Embodiment approach

[0054] In the third embodiment of the present invention, the thickness of the outer green sheet 14a1 to be laminated on the lowermost side is made thinner than the thickness of the other outer green sheets 14a2. Specifically, the thickness of the outer green sheet 14a1 is reduced to about 20% to 80% of the thickness of the other outer green sheet 14a2. More specifically, when the thickness of the outer green sheet 14a2 is 5 μm to 15 μm, the thickness of the outer green sheet 14a1 is 1 μm to 12 μm. In order to form a thin sheet, it is possible to change the discharge amount of the doctor blade or to increase the travel speed of the film during dielectric slurry coating.

[0055] By varying the thickness of the same outer green sheets in this way, the outer green sheet 14a1 has a weaker adhesive force than the other green sheets 14a2, 10a, 14a3, and 14a4. Other configurations and effects are the same as those of the first embodiment. In addition, since the thickness of the she...

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Abstract

The present invention aims to provide a method for manufacturing a multilayer electronic component capable to remove a multilayer body very easily from the press mold without breaking the multilayer body when removing a green sheet multilayer body applied with a pressure from the press mold, furthermore has no waste of material, contributes to the environment conservation, and also easy to automate. Among the plurality of green sheets constituting a multilayer body 4a, the adhesive force of at least one of the outer green sheet 14a1 contacting to the lower mold 20 of the press mold 20 is made weaker compared to that of other green sheet 14a2, 10a, 14a3, and 14a4 of which are stacked with said outer green sheet 14a1. Next, a pressure is applied to the multilayer body 4a on the lower mold 20 of the press mold. Then, the press mold 25 is removed from the multilayer body 4a which is applied with the pressure.

Description

technical field [0001] The present invention relates to a method for manufacturing laminated electronic components. More specifically, the present invention relates to the ability to take out a laminated body from a die very easily without causing a A method of manufacturing a laminated electronic component in which the laminate is damaged. Background technique [0002] For example, laminated electronic components such as laminated ceramic capacitors are produced by stacking and laminating a large number of ceramic green sheets on which internal electrode patterns are formed, and pressing the laminated body with a die. However, when the laminated body of the green sheet is pressed with a die and the laminated body is taken out, the surface of the laminated body in contact with the die sticks to the die, and when the laminated body is forcibly taken out, there is a problem that the laminated body is damaged or deformed. . [0003] In order to prevent such a problem, for exa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01G4/12H01G4/30
CPCH01G13/00H01G4/30Y10T156/10H01G4/33
Inventor 井口俊宏吉井彰敏五岛亮长谷部和幸
Owner TDK CORPARATION
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