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Imaging detector

A technology for imaging detectors and detectors, which is applied in instruments, measuring devices, image communication, etc., can solve the problems of difficulty in manufacturing and obtain commercial devices, and achieve the effects of good absorption and increased sensing efficiency.

Active Publication Date: 2009-09-02
PANALYTICAL BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] However, this configuration has proven difficult to manufacture in practice to obtain commercial devices

Method used

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Embodiment Construction

[0031] refer to figure 1 , the sensor 10 is mounted on the readout chip 20 by using a plurality of bump contacts 30, each bump contact corresponding to a single pixel. The readout chip comprises an independent photon counting detector 22 for each pixel and thus each bump contact 30 .

[0032] The sensor 10 comprises two sensor material layers 12 , 14 . The first of these sensor material layers is a silicon substrate 12 and the second sensor material layer is a germanium epitaxial layer 14 . In an embodiment, the substrate 12 is 300 μm thick and the epitaxial layer is 50 μm thick. A thin buffer layer 16 is provided between the substrate 12 and the epitaxial layer 14, the buffer layer has a composition gradient of silicon and germanium, a high silicon content near the silicon substrate 12, and a high Si content near the germanium epitaxial layer 14. Germanium content to minimize lattice strain and deformation.

[0033] The ohmic contact 42 is formed by being inserted into th...

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PUM

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Abstract

The unvention discloses an imaging detector. A hybrid imaging detector is for detecting ionizing radiation such as X-rays or electron radiation. The detector has a sensor (10) on a read-out chip (20).The sensor (10) includes a plurality of sensor material layers (12, 14) of different materials stacked on top of one another, having differing radiation absorbing properties. The materials may be Siand SiGe, Si and Ge, or Si and amorphous Se, for example. The read-out chip is a photon-counting read-out chip that records a single count when a pulse above a threshold is detected.

Description

technical field [0001] The present invention relates to an imaging radiation detector and in a particular embodiment to a hybrid radiation detector comprising an integrated circuit for performing counting of X-rays, electrons or generally ionizing radiation. Background technique [0002] Imaging radiation detectors such as those used in x-rays or electrons can be of the hybrid type, where the readout chip includes electronics for reading out and processing the data, and the sensor is mounted directly on the readout chip, the device has many A regular grid of pixels (planar geometry) of interconnection bonds (bonds) between the sensor and the readout chip. In an alternative arrangement, the sensor itself has pixels (three-dimensional geometry) resulting from a regular arrangement of electrodes machined into the sensor. The pixels are used for spatially resolved detection of X-rays, electrons or generally ionizing radiation reaching the corresponding pixel. When X-rays, elec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/115H01L25/00H01L27/146H01L21/20
CPCG01T1/247G01T1/24H04N25/79
Inventor K·贝思克
Owner PANALYTICAL BV
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