Polyorganosiloxane composition

A technology of polyorganosiloxane and composition, which is applied in the direction of optomechanical equipment, coatings, instruments, etc., can solve the problems of unoptimized volatile components, undisclosed specific parts of gaskets, etc., and achieve excellent transparency and high heat resistance Excellent performance in terms of sensitivity and photosensitivity

Inactive Publication Date: 2009-09-02
ASAHI KASEI KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] The third point is that since the gasket forms a closed space containing microstructures, if the record of Patent Document 3 is cited, it is a substance that forms a "cavity", so after the packaging is completed, the volatilization contained therein It is not preferable that components etc. remain
[0013] Although it is considered that the gasket needs to have the above characteristics, in Patent Document 3, no specific parts applicable to the gasket are disclosed

Method used

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  • Polyorganosiloxane composition
  • Polyorganosiloxane composition
  • Polyorganosiloxane composition

Examples

Experimental program
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Embodiment

[0194] Next, the present invention will be described based on Examples and Comparative Examples.

Synthetic example 1

[0196] (Synthesis of polyorganosiloxane P-1)

[0197] In a 2-liter round-bottomed flask equipped with a water-cooled condenser and a vacuum-sealed stirring blade, 540.78 g (2.5 mol) of diphenylsilanediol (hereinafter DPD), 577.41 g (2.325 mol) of 3- Methacryloxypropyltrimethoxysilane (hereinafter MEMO), 24.87g (0.0875mol) tetraisopropoxytitanium (hereinafter TIP), and start stirring. This was immersed in an oil bath, the heating temperature was set to 120° C., and heating was started from room temperature. During this process, the reaction was performed until the temperature of the reaction solution became constant while refluxing methanol generated during the polymerization reaction using a water-cooled condenser, and then heating and stirring were continued for 30 minutes.

[0198] Then, a hose connecting the cold tank and a vacuum pump was equipped, and while heating at 80° C. using an oil bath, strong stirring was carried out, and by gradually increasing the degree of vac...

Synthetic example 2

[0200] (Synthesis of polyorganosiloxane P-2)

[0201] In a 2-liter round-bottomed flask equipped with a water-cooled condenser and a stirring blade with vacuum sealing, charge 432.62g (2.0mol) DPD, 495.71g (1.996mol) MEMO, 0.568g (0.002mol) TIP, 0.16 g (0.004mol) sodium hydroxide, start stirring. Immerse it in an oil bath, set the heating temperature to 80°C, and start heating from room temperature. During this process, the reaction was performed until the temperature of the reaction solution became constant while refluxing methanol generated during the polymerization reaction using a water-cooled condenser, and then heating and stirring were continued for 30 minutes.

[0202] Then, the reaction solution was cooled to room temperature and passed through a glass column filled with an ion exchange resin (AMBERLYST15 manufactured by ORGANO CORPORATION, a material with a dry weight of 40 g was expanded and washed with methanol) to remove sodium ions.

[0203] Transfer it to a ro...

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Abstract

Disclosed is a polyorganosiloxane composition containing the following components (a)-(c). (a) 100 parts by mass of a polyorganosiloxane obtained by mixing at least one silanol compound represented by the general formula (1) below, at least one alkoxysilane compound represented by the general formula (2) below, and at least one catalyst selected from the group consisting of compounds represented by the general formula (3) below, compounds represented by the general formula (4) below and Ba(OH)2, and polymerizing the mixture without actively adding water thereinto [chemical formula 1] R2Si(OH)2 (1)[chemical formula 2] R'Si(OR'')3 (2) [chemical formula 3] M(OR''')4 (3) [chemical formula 4] M'(OR'''')3 (4) (b) 0.1-20 parts by mass of a photopolymerization initiator (c) 1-100 parts by mass of a compound other than the component (a) having two or more photopolymerizable unsaturated bonding groups.

Description

technical field [0001] The present invention relates to the formation of insulating materials for electronic components, surface protective films, interlayer insulating films, α-ray shielding films, etc. in semiconductor devices, and semiconductor devices equipped with image sensors, micromachines, or microactuators The resin composition used in etc., and the semiconductor device etc. manufactured using it. More specifically, it relates to a novel polyorganosiloxane composition, which has excellent photosensitive properties under UV-i rays and can be cured at a low temperature below 250°C. The volume shrinkage during the process is extremely small. In addition, in the resin structure and resin film after heat curing, excellent transparency and low outgassing can be achieved at a high level, and pre-baking and post-baking (Soft -bake) is non-tacky, and relates to semiconductor devices and the like manufactured using the polyorganosiloxane composition. Background technique ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08F290/14G02B1/04G03F7/027G03F7/075C08G77/20
CPCC09D151/085C08L51/085C08G77/20C08F283/12C08F290/148C09D183/14G03F7/0757C08G77/58C08L2666/02C08L83/00C08F290/14C08L83/04G02B1/04
Inventor 木村正志美河正人藤山英之小林隆昭赖末友裕
Owner ASAHI KASEI KK
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