Photosensitive resin composition, photosensitive resin film, multilayer printed wiring board, semiconductor package, and method for producing multilayer printed wiring board
A photosensitive resin and composition technology, applied in the field of photosensitive resin compositions, can solve the problems of reduced photosensitive properties such as sensitivity and resolution of the photosensitive layer, insufficient peelability, and difficulty in taking into account the peelability of the support film and the photosensitivity performance. , to achieve the effect of efficient manufacturing and excellent peelability
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[0375] Hereinafter, although an Example demonstrates this invention in detail, this invention is not limited to these Examples.
[0376] In addition, the photosensitive resin composition obtained in each example evaluated the characteristic by the method shown below.
[0377] [1. Evaluation of photosensitive characteristics (through-hole resolution)]
[0378] On a copper-clad laminate substrate (MCL-E-67, manufactured by Hitachi Chemical Co., Ltd.) with a thickness of 1.0 mm, the protective film (protective layer) of the photosensitive resin film with the support film and protective film produced in each example was ) was peeled off, and a laminated body having a photosensitive layer was obtained by performing a lamination process using a pressure-type vacuum laminator (MVLP-500, manufactured by Meiki Seisakusho Co., Ltd., model number). It should be noted that the lamination conditions were set as follows: crimping pressure 0.4 MPa, pressure heating plate temperature 75° C.,...
Synthetic example 1
[0388] Synthesis of acid-modified epoxy derivative 1 [(A1-1) component] containing ethylenically unsaturated group and alicyclic skeleton
[0389] Add dicyclopentadiene type epoxy resin [Nippon Kayaku Co., Ltd. "XD-1000", epoxy equivalent 252g / eq, softening point 74.2 ° C, equivalent to (a1) component, by the above general formula (a1-1 )express. The number of ring-forming carbon atoms of the alicyclic skeleton: 10] 250 parts by mass, 70 parts by mass of acrylic acid (corresponding to component (a2)) 70 parts by mass, 0.5 parts by mass of methylhydroquinone, 120 parts by mass of carbitol acetate, heated Reaction was carried out at 90° C. with stirring, and the mixture was completely dissolved.
[0390] Next, the obtained solution was cooled to 60 degreeC, 2 mass parts of triphenylphosphine was added, it heated at 100 degreeC, and it reacted until the acid value of a solution became 1 mgKOH / g. 98 parts by mass of tetrahydrophthalic anhydride (corresponding to component (a3))...
Embodiment 1~6、 comparative example 1~4
[0393] (Preparation of photosensitive resin composition)
[0394] The composition was compounded according to the compounding composition and compounding quantity shown in Table 1, and it kneaded using the three-roll mill, and the photosensitive resin composition was prepared. In each example, methyl ethyl ketone was appropriately added to adjust the concentration, and a photosensitive resin composition having a solid content concentration of 60% by mass was obtained.
[0395] (Production of photosensitive resin film)
[0396] A polyethylene terephthalate film (G2-16, manufactured by Teijin Co., Ltd., trade name) with a thickness of 16 μm was used as a support film, and the photosensitive resin composition prepared in each example was prepared at a film thickness after drying. It coated on this support film so that it might become 5 micrometers, and dried at 75 degreeC for 30 minutes using the hot-air convection type dryer, and formed the photosensitive resin film (photosensi...
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